LM4894ITP datasheet, PDF - EEWORLD Datasheet

LM4894ITP: DescriptionIC,AUDIO AMPLIFIER,SINGLE,BGA,9PIN,PLASTIC; CategoryAnalog mixed-signal IC Consumption circuit; File Size801KB，20 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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LM4894ITP Overview

IC,AUDIO AMPLIFIER,SINGLE,BGA,9PIN,PLASTIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	FBGA, BGA9,3X3,20
Reach Compliance Code	compli
Commercial integrated circuit types	AUDIO AMPLIFIER
JESD-30 code	S-PBGA-B9
JESD-609 code	e0
Humidity sensitivity level	1
Number of terminals	9
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA9,3X3,20
Package shape	SQUARE
Package form	GRID ARRAY, FINE PITCH
power supply	3/5 V
Certification status	Not Qualified
Maximum slew rate	8 mA
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn63Pb37)
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM

	LM4894ITP	LM4894ITPX
Description	IC,AUDIO AMPLIFIER,SINGLE,BGA,9PIN,PLASTIC	IC,AUDIO AMPLIFIER,SINGLE,BGA,9PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments
package instruction	FBGA, BGA9,3X3,20	FBGA, BGA9,3X3,20
Reach Compliance Code	compli	compli
Commercial integrated circuit types	AUDIO AMPLIFIER	AUDIO AMPLIFIER
JESD-30 code	S-PBGA-B9	S-PBGA-B9
JESD-609 code	e0	e0
Humidity sensitivity level	1	1
Number of terminals	9	9
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FBGA	FBGA
Encapsulate equivalent code	BGA9,3X3,20	BGA9,3X3,20
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH
power supply	3/5 V	3/5 V
Certification status	Not Qualified	Not Qualified
Maximum slew rate	8 mA	8 mA
surface mount	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)
Terminal form	BALL	BALL
Terminal pitch	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM

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