SN74HC283J4 Related Products
|
SN74HC283J4 |
SN74HC283NP3 |
SN74HC283N3 |
SN74HC283D3 |
SN74HC283JP4 |
| Description |
SN74HC283J4 |
SN74HC283NP3 |
SN74HC283N3 |
SN74HC283D3 |
SN74HC283JP4 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| package instruction |
DIP, DIP16,.3 |
DIP, DIP16,.3 |
DIP, DIP16,.3 |
SOP, SOP16,.25 |
DIP, DIP16,.3 |
| Reach Compliance Code |
_compli |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
| JESD-30 code |
R-XDIP-T16 |
R-PDIP-T16 |
R-PDIP-T16 |
R-PDSO-G16 |
R-XDIP-T16 |
| Logic integrated circuit type |
ADDER/SUBTRACTOR |
ADDER/SUBTRACTOR |
ADDER/SUBTRACTOR |
ADDER/SUBTRACTOR |
ADDER/SUBTRACTOR |
| Number of terminals |
16 |
16 |
16 |
16 |
16 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| Package body material |
CERAMIC |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
CERAMIC |
| encapsulated code |
DIP |
DIP |
DIP |
SOP |
DIP |
| Encapsulate equivalent code |
DIP16,.3 |
DIP16,.3 |
DIP16,.3 |
SOP16,.25 |
DIP16,.3 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
IN-LINE |
| power supply |
2/6 V |
2/6 V |
2/6 V |
2/6 V |
2/6 V |
| surface mount |
NO |
NO |
NO |
YES |
NO |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
| Terminal pitch |
2.54 mm |
2.54 mm |
2.54 mm |
1.27 mm |
2.54 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |