TM4256GP8-20L datasheet, PDF - EEWORLD Datasheet

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TM4256GP8-20L: Description256KX8 MULTI DEVICE DRAM MODULE, 200ns, SMA30, 3.500 X 0.450 INCH, SIMM-30; Categorystorage storage; File Size86KB，3 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TM4256GP8-20L Overview

256KX8 MULTI DEVICE DRAM MODULE, 200ns, SMA30, 3.500 X 0.450 INCH, SIMM-30

TM4256GP8-20L Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	SIMM
package instruction	SIMM, SIM30
Contacts	30
Reach Compliance Code	unknow
ECCN code	EAR99
access mode	PAGE
Maximum access time	200 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	COMMON
JESD-30 code	R-XSMA-N30
memory density	2097152 bi
Memory IC Type	DRAM MODULE
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	30
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX8
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	SIMM
Encapsulate equivalent code	SIM30
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	5 V
Certification status	Not Qualified
refresh cycle	256
Maximum seat height	11.43 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	NMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	2.54 mm
Terminal location	SINGLE

TM4256GP8-20L Related Products

	TM4256GP8-20L	TM4256GV8-15L	TM4256GP8-12L	TM4256GP8-15L	TM4256GV8-12L
Description	256KX8 MULTI DEVICE DRAM MODULE, 200ns, SMA30, 3.500 X 0.450 INCH, SIMM-30	256KX8 MULTI DEVICE DRAM MODULE, 150ns, SMA30, 3.100 X 0.450 INCH, SIMM-30	256KX8 MULTI DEVICE DRAM MODULE, 120ns, SMA30, 3.500 X 0.450 INCH, SIMM-30	256KX8 MULTI DEVICE DRAM MODULE, 150ns, SMA30, 3.500 X 0.450 INCH, SIMM-30	256KX8 MULTI DEVICE DRAM MODULE, 120ns, SMA30, 3.100 X 0.450 INCH, SIMM-30
Parts packaging code	SIMM	SIMM	SIMM	SIMM	SIMM
package instruction	SIMM, SIM30	, SIP30,.2	3.500 X 0.450 INCH, SIMM-30	3.500 X 0.450 INCH, SIMM-30	, SIP30,.2
Contacts	30	30	30	30	30
Reach Compliance Code	unknow	not_compliant	unknown	unknown	_compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	PAGE	PAGE	PAGE	PAGE	PAGE
Maximum access time	200 ns	150 ns	120 ns	150 ns	120 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XSMA-N30	R-XSMA-T30	R-XSMA-N30	R-XSMA-N30	R-XSMA-T30
memory density	2097152 bi	2097152 bit	2097152 bit	2097152 bit	2097152 bi
Memory IC Type	DRAM MODULE	DRAM MODULE	DRAM MODULE	DRAM MODULE	DRAM MODULE
memory width	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of ports	1	1	1	1	1
Number of terminals	30	30	30	30	30
word count	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX8	256KX8	256KX8	256KX8	256KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Encapsulate equivalent code	SIM30	SIP30,.2	SIM30	SIM30	SIP30,.2
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	256	256	256	256	256
Maximum seat height	11.43 mm	11.43 mm	11.43 mm	11.43 mm	11.43 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO
technology	NMOS	NMOS	NMOS	NMOS	NMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE
Maker	Texas Instruments	-	Texas Instruments	Texas Instruments	Texas Instruments
encapsulated code	SIMM	-	SIMM	SIMM	-

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