TM4256HE4-15L datasheet, PDF - EEWORLD Datasheet

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TM4256HE4-15L: Description512KX4 MULTI DEVICE DRAM MODULE, 150ns, SMA22, 2.400 X 0.450 INCH, SIMM-22; Categorystorage storage; File Size82KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TM4256HE4-15L Overview

512KX4 MULTI DEVICE DRAM MODULE, 150ns, SMA22, 2.400 X 0.450 INCH, SIMM-22

TM4256HE4-15L Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	SIMM
package instruction	, SIP24,.2
Contacts	22
Reach Compliance Code	_compli
ECCN code	EAR99
access mode	PAGE
Maximum access time	150 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	SEPARATE
JESD-30 code	R-XSMA-T22
memory density	2097152 bi
Memory IC Type	DRAM MODULE
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	22
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX4
Output characteristics	3-STATE
Package body material	UNSPECIFIED
Encapsulate equivalent code	SIP24,.2
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
refresh cycle	256
Maximum slew rate	0.068 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	NMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	SINGLE
Maximum time at peak reflow temperature	NOT SPECIFIED

TM4256HE4-15L Related Products

	TM4256HE4-15L	TM4256HE4-20L	TM4256HE4-12L
Description	512KX4 MULTI DEVICE DRAM MODULE, 150ns, SMA22, 2.400 X 0.450 INCH, SIMM-22	512KX4 MULTI DEVICE DRAM MODULE, 200ns, SMA22, 2.400 X 0.450 INCH, SIMM-22	512KX4 MULTI DEVICE DRAM MODULE, 120ns, SMA22, 2.400 X 0.450 INCH, SIMM-22
Is it lead-free?	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	SIMM	SIMM	SIMM
package instruction	, SIP24,.2	, SIP24,.2	, SIP24,.2
Contacts	22	22	22
Reach Compliance Code	_compli	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99
access mode	PAGE	PAGE	PAGE
Maximum access time	150 ns	200 ns	120 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	SEPARATE	SEPARATE	SEPARATE
JESD-30 code	R-XSMA-T22	R-XSMA-T22	R-XSMA-T22
memory density	2097152 bi	2097152 bit	2097152 bit
Memory IC Type	DRAM MODULE	DRAM MODULE	DRAM MODULE
memory width	4	4	4
Number of functions	1	1	1
Number of ports	1	1	1
Number of terminals	22	22	22
word count	524288 words	524288 words	524288 words
character code	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C
organize	512KX4	512KX4	512KX4
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Encapsulate equivalent code	SIP24,.2	SIP24,.2	SIP24,.2
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
refresh cycle	256	256	256
Maximum slew rate	0.068 mA	0.058 mA	0.078 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	NO	NO	NO
technology	NMOS	NMOS	NMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm
Terminal location	SINGLE	SINGLE	SINGLE
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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