GUB-GM8A-01-3701-B-D datasheet, PDF

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GUB-GM8A-01-3701-B-D: DescriptionArray/Network Resistor, Isolated, Thin Film, 1.2W, 3700ohm, 0.1% +/-Tol, 100ppm/Cel, Surface Mount, 2244, DIP; CategoryPassive components The resistor; File Size493KB，3 Pages; ManufacturerTT Electronics plc; Websitehttp://www.ttelectronics.com/

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GUB-GM8A-01-3701-B-D Overview

Array/Network Resistor, Isolated, Thin Film, 1.2W, 3700ohm, 0.1% +/-Tol, 100ppm/Cel, Surface Mount, 2244, DIP

GUB-GM8A-01-3701-B-D Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	TT Electronics plc
package instruction	SMT, 2244
Reach Compliance Code	compli
ECCN code	EAR99
Other features	ULTRA PRECISION
structure	Molded
Component power consumption	0.16 W
The first element resistor	3700 Ω
JESD-609 code	e0
Manufacturer's serial number	GUB
Installation features	SURFACE MOUNT
Network Type	ISOLATED
Number of components	1
Number of functions	8
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package height	2.286 mm
Package length	11.176 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	5.588 mm
Rated power dissipation(P)	1.2 W
Rated temperature	70 °C
resistance	3700 Ω
Resistor type	ARRAY/NETWORK RESISTOR
series	GUB
size code	2244
surface mount	YES
technology	THIN FILM
Temperature Coefficient	100 ppm/°C
Temperature coefficient tracking	5 ppm/°C
Terminal surface	Tin/Lead (Sn/Pb)
Terminal shape	GULL WING
Tolerance	0.1%

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TaNFilm

Small Outline Surface

Mount Resistor Network

GUB Series

•

Thin ﬁlm on ceramic technology

0.220” and 0.300” sizes available

RoHS compliant version available

DESC 87012 and 87013 available

Standard JEDEC packages for automatic placement equipment

Compliant leads to

compensate for

thermal expansion

and contractions.

IRC Advanced Film Division

Ultra precision tantalum

nitride resistance element

on high purity alumina.

Rugged, molded

construction.

IRC’s TaNFilm®, Small Outline Integrated Circuit resistor networks are ideally suited for surface mounting.

The 0.05 inch lead spacing provides higher lead density, increased component count, lower installed resistor

cost, and better reliability. They are ideally suited for the latest surface mount assembly techniques, and each

lead can be 100% visually inspected. The compliant leads relieve thermal expansion and contraction stressed

created by soldering and temperature excursions.

The tantalum nitride film system provides precision tolerance, exceptional TCR tracking, and low noise.

TaNFilm® provides stability, high reliability, and long life characteristics. Testing has demonstrated performance

exceeding MIL-PRF-83401 characteristics H.

Electrical Data

GM Type

Resistance Range (Ω)

GL Type

Absolute Tolerance

Ratio Tolerance To R1

TCR (ppm/°C)

TCR Tracking To R1 (ppm°C)

Operating Temperature Range

Noise

Substrate

Custom circuits and special testing available.

Schem A: 10 to 200K

Schem B: 10 to 1000K

Schem A: 10 to 150K

Schem B: 10 to 75K

Available to ±0.1%

Available to ±0.05%

±25, ±50, ±100

±5

-55°C to +125°C

Less than -25 dB

High purity alumina substrate

General Note

IRC reserves the right to make changes in product speciﬁcation without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print.

• 4222 South Staples Street • Corpus Christi Texas 78411 USA

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

A subsidiary of

TT electronics plc

GUB Series Issue November 2008 Sheet 1 of 3

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