High Performance BGA Cooling
Solutions with superGRIP™ Attachment
ATS PART # ATS-X53330P-C1-R0
Features & Benefits
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Designed for 33 x 33 mm Bga components
supergrip
tm
super strong, uniform attachment force helps achieve
maximum performance from phase-changing tim and does not require
holes in the pcB
allows the heat sink to be detached and reattached without damaging the
component and/or the pcB, an important feature in the event a pcB may
need to be reworked
meets telcordia gr-63-core office vibration, etsi 300 019
transportation vibration, and mil-stD-810 shock testing and
unpackaged Drop testing standards
requires minimal space around the component’s perimeter; ideal for
densely populated pcBs
“keep-out” requirements: an “un-populated” boarder zone of 3 mm
around the component is necessary to facilitate the installation/removal of
the supergrip™. please refer to the supergrip™ keep-out guidelines
and supergrip™ installation/removal instructions for further details
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thermal Performance
AIR VELOCITy
*Image above is for illustration purposes only.
THERMAL RESISTANCE
ft/min
200
300
400
500
600
700
800
m/s
1.0
1.5
2.0
2.5
3.0
3.5
4.0
°c/w (unDucteD flow)
4.1
3.0
2.6
2.3
2.1
2.0
1.8
°c/w (DucteD flow)
2.3
Product Details
DIMENSION A
33 mm
Notes:
1)
2)
3)
4)
5)
DIMENSION B
33 mm
DIMENSION C
17.5 mm
DIMENSION D
33 mm
INTERFACE MATERIAL
chomerics t-766
FINISH
Blue anoDizeD
Dimensions are measureD in millimeters
Dimensions a & B refer to component size
Dimension c = the height of the heat sink shown aBove anD Does not
incluDe the height of the attachment methoD
ats reserves the right to upDate or change it proDucts without
notice
contact ats to learn aBout custom options availaBle
For more information, to find a distributor or to place an order, visit www.qats.com or
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).
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Automotive Electronics
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