v2.7
Axcelerator Family FPGAs
u e
™
Leading-Edge Performance
•
•
•
•
•
•
•
•
•
350+ MHz System Performance
500+ MHz Internal Performance
High-Performance Embedded FIFOs
700 Mb/s LVDS Capable I/Os
Up to 2 Million Equivalent System Gates
Up to 684 I/Os
Up to 10,752 Dedicated Flip-Flops
Up to 295 kbits Embedded SRAM/FIFO
Manufactured on Advanced 0.15
μm
CMOS Antifuse
Process Technology, 7 Layers of Metal
Single-Chip, Nonvolatile Solution
Up to 100% Resource Utilization with 100% Pin Locking
1.5V Core Voltage for Low Power
Footprint Compatible Packaging
Flexible, Multi-Standard I/Os:
– 1.5V, 1.8V, 2.5V, 3.3V Mixed Voltage Operation
– Bank-Selectable I/Os – 8 Banks per Chip
– Single-Ended I/O Standards: LVTTL, LVCMOS, 3.3V
PCI, and 3.3V PCI-X
– Differential I/O Standards: LVPECL and LVDS
AX125
125,000
82,000
672
1,344
1,344
4
18,432
4
4
8
8
168
84
504
180
Specifications
•
Features
•
•
•
•
•
•
•
•
•
•
•
Voltage-Referenced I/O Standards: GTL+, HSTL
Class 1, SSTL2 Class 1 and 2, SSTL3 Class 1 and 2
– Registered I/Os
– Hot-Swap Compliant I/Os (except PCI)
– Programmable Slew Rate and Drive Strength on
Outputs
– Programmable Delay and Weak Pull-Up/Pull-Down
Circuits on Inputs
Embedded Memory:
– Variable-Aspect 4,608-bit RAM Blocks (x1, x2, x4,
x9, x18, x36 Organizations Available)
– Independent, Width-Configurable Read and Write Ports
– Programmable Embedded FIFO Control Logic
Segmentable Clock Resources
Embedded Phase-Locked Loop:
– 14-200 MHz Input Range
– Frequency Synthesis Capabilities up to 1 GHz
Deterministic, User-Controllable Timing
Unique In-System Diagnostic and Debug Capability
with Actel Silicon Explorer II
Boundary-Scan Testing Compliant with IEEE Standard
1149.1 (JTAG)
FuseLock
TM
Secure Programming Technology
Prevents Reverse Engineering and Design Theft
–
Table 1-1 •
Axcelerator Family Product Profile
Device
Capacity (in Equivalent System Gates)
Typical Gates
Modules
Register (R-cells)
Combinatorial (C-cells)
Maximum Flip-Flops
Embedded RAM/FIFO
Number of Core RAM Blocks
Total Bits of Core RAM
Clocks (Segmentable)
Hardwired
Routed
PLLs
I/Os
I/O Banks
Maximum User I/Os
Maximum LVDS Channels
Total I/O Registers
Package
CSP
PQFP
BGA
FBGA
CQFP
CCGA
AX250
250,000
154,000
1,408
2,816
2,816
12
55,296
4
4
8
8
248
124
744
AX500
500,000
286,000
2,688
5,376
5,376
16
73,728
4
4
8
8
336
168
1,008
AX1000
1,000,000
612,000
6,048
12,096
12,096
36
165,888
4
4
8
8
516
258
1,548
AX2000
2,000,000
1,060,000
10,752
21,504
21,504
64
294,912
4
4
8
8
684
342
2,052
208
256, 324
256, 484
208, 352
208
484, 676
208, 352
729
484, 676, 896
352
624
896, 1152
352
624
November 2008
© 2008 Actel Corporation
i
*See Actel’s website for the latest version of the datasheet.
Axcelerator Family FPGAs
Ordering Information
AX1000 _
1
FG
G
896
I
Application
Blank =
Commercial
(0 to +70°
C)
PP = Pre-Production
I = Industrial (-40 to +85°
C)
M = Military (-55 to +125°
C)
B = MIL-STD-883
Class
B
Package Lead
Count
Lead-Free Packaging
Blank =
Standard
Packaging
G=
RoHS-Compliant Packaging
Package Type
BG = Ball
Grid
Array (1.27mm pitch)
FG = Fine Ball
Grid
Array (1.0mm pitch)
CS
=
Chip Scale
Package (0.8mm pitch)
PQ = Plastic Quad Flat Pack (0.5mm pitch)
CQ
=
Ceramic
Quad Flat Pack (0.5mm pitch)
CG
=
Ceramic Column Grid
Array
Speed Grade
Blank =
Standard Speed
1 = Approximately 15% Faster than
Standard
2 = Approximately 25% Faster than
Standard
Part Number
AX125 = 125,000 Equivalent
System Gates
AX250 = 250,000 Equivalent
System Gates
AX500 = 500,000 Equivalent
System Gates
AX1000 = 1,000,000 Equivalent
System Gates
AX2000 = 2,000,000 Equivalent
System Gates
Device Resources
User I/Os (Including Clock Buffers)
Package
CS180
PQ208
CQ208
FG256
FG324
CQ352
FG484
CG624
FG676
BG729
FG896
FG1152
AX125
98
–
–
138
168
–
–
–
–
–
–
–
AX250
–
115
115
138
–
198
248
–
–
–
–
–
AX500
–
115
115
–
–
198
317
–
336
–
–
–
AX1000
–
–
–
–
–
198
317
418
418
516
516
–
AX2000
–
–
–
–
–
198
–
418
–
–
586
684
Note:
The FG256, FG324, and FG484 are footprint compatible with one another. The FG676, FG896, and FG1152 are also footprint
compatible with one another.
ii
v2.7
Axcelerator Family FPGAs
Temperature Grade Offerings
Package
CS180
PQ208
CQ208
FG256
FG324
CQ352
FG484
CG624
FG676
BG729
FG896
FG1152
Notes:
1.
2.
3.
4.
C = Commercial
I = Industrial
M = Military
B = MIL-STD-883 Class B
AX125
C, I
–
–
C, I
C, I
–
–
–
–
–
–
–
AX250
–
C, I, M
M, B
C, I, M
–
M, B
C, I, M
–
–
–
–
–
AX500
–
C, I, M
M, B
–
–
M, B
C, I, M
–
C, I, M
–
–
–
AX1000
–
–
–
–
–
M, B
C, I, M
M, B
C, I, M
C, I, M
C, I, M
–
AX2000
–
–
–
–
–
M, B
–
M, B
–
–
C, I, M
C, I, M
Speed Grade and Temperature Grade Matrix
Std
C
I
M
B
Notes:
5.
6.
7.
8.
C = Commercial
I = Industrial
M = Military
B = MIL-STD-883 Class B
✓
✓
✓
✓
–1
✓
✓
✓
✓
–2
✓
✓
–
–
Packaging Data
Refer to the following documents located on the Actel website for additional packaging information.
Package Mechanical Drawings
Package Thermal Characteristics and Weights
Hermatic Package Mechanical Information
Contact your local Actel representative for device availability.
v2.7
iii
Axcelerator Family FPGAs
Table of Contents
General Description
Device Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Programmable Interconnect Element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Logic Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Embedded Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
I/O Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Routing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
Global Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
Low Power (LP) Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Design Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
In-System Diagnostic and Debug Capabilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
Detailed Specifications
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
I/O Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
Voltage-Referenced I/O Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-32
Differential Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-39
Module Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-43
Routing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-50
Global Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-55
Axcelerator Clock Management System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-63
Embedded Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-72
Other Architectural Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-89
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-91
Package Pin Assignments
180-Pin CSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
729-Pin PBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
256-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
324-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
484-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22
676-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36
896-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-49
iv
v2.7
Axcelerator Family FPGAs
Table of Contents
1152-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-67
208-Pin PQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-78
208-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-83
352-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-88
624-Pin CCGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-102
Datasheet Information
List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
Export Administration Regulations (EAR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
v2.7
v
DSP and ARM Processors
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