V•I Chip – BCM
Bus Converter Module
TM
B048K120T20
+ +
–
K
–
©
1
V•I
• 48 V to 12 V V•I Chip Converter
• 200 Watt (300 Watt for 1 ms)
• High density – up to 800 W/in
3
• Small footprint – 200 W/in
2
• Low weight – 0.5 oz (14 g)
• ZVS/ZCS isolated sine
amplitude converter
• >96% efficiency
• 125°C operation
• 1 µs transient response
• >3.5 million hours MTBF
• No output filtering required
• BGA or J-Lead packages
Vin = 42 - 53 V
Vout = 10.5 - 13.25 V
Iout = 17.0 A
K =
1
/
4
Rout = 25 mΩ max
Actual size
Product Description
The V•I Chip Bus Converter Module
(BCM) is a high efficiency (>96%),
narrow input range Voltage
Transformation Module (VTM) operating
from a 48 Vdc bus to deliver an isolated
12 V secondary for Intermediate Bus
Architecture applications. The BCM may
be used to power non-isolated POL
converters or as an independent 12 V
source. Due to the fast response time and
low noise of the BCM, the need for
limited life aluminum electrolytic or
tantalum capacitors at the input of POL
converters is reduced—or eliminated—
resulting in savings of board area,
materials and total system cost.
The BCM achieves a power density of
800 W/in
3
and may be surface mounted
with a profile as low as 0.16" (4mm) over
the PCB. Its V•I Chip power package is
compatible with on-board or in-board
surface mounting. The V•I Chip package
provides flexible thermal management
through its low Junction-to-Case and
Junction-to-BGA thermal resistance.
Owing to its high conversion efficiency
and safe operating temperature range, the
BCM does not require a discrete heat sink
in typical applications. It is also
compatible with heat sink options,
assuring low junction temperatures and
long life in the harshest environments.
Absolute Maximum Ratings
Parameter
+In to -In
+In to -In
PC to -In
TM to -In
+Out to -Out
Isolation voltage
Operating junction temperature
Output current
Peak output current
Case temperature during reflow
Storage temperature
Output power
Peak output power
Values
-1.0 to 60.0
100
-0.3 to 7.0
-0.3 to 7.0
-0.5 to 15.0
2250
-40 to 125
17.0
25
208
-40 to 150
200
300
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
°C
A
A
°C
°C
W
W
Notes
For 100 ms
Input to Output
T grade; See note 2
Continuous
For 1 ms
Continuous
For 1 ms
Thermal Resistance
Symbol
R
θJC
R
θJB
R
θJA
R
θJA
Parameter
Junction-to-case
Junction-to-BGA
Junction-to-ambient
3
Junction-to-ambient
4
Typ
1.1
2.1
Max
1.5
2.5
Units
°C/W
°C/W
°C/W
°C/W
6.5
5.0
7.2
5.5
Notes
1. For complete product matrix see chart on page 10.
2. The referenced junction is defined as the semiconductor having the highest temperature. This
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
3. B048K120T20 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
4. B048L120T20 (0.25"H optional Pin Fins) surface mounted on FR4 board, 300 LFM.
45
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Bus Converter
B048K120T20
Rev. 2.2
Page 1 of 16
Specifications
INPUT
(Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Input voltage range
Input dV/dt
Input undervoltage turn-on
Input undervoltage turn-off
Input overvoltage turn-on
Input overvoltage turn-off
Input quiescent current
Inrush current overshoot
Input current
Input reflected ripple current
No load power dissipation
Internal input capacitance
Internal input inductance
Recommended external input capacitance
Min
42
Typ
48
Max
53
1
42
Unit
Vdc
V/µs
Vdc
Vdc
Vdc
Vdc
mA
A
Adc
mA p-p
W
µF
nH
µF
Note
37
53
1.5
2.9
30
2.50
2
20
10
59
1.8
4.65
50
3.00
PC low
Using test circuit in Fig.22; See Fig.1
Using test circuit in Fig.22; See Fig.4
200 nH maximum source inductance; See Fig.22
INPUT WAVEFORMS
Figure 1—
Inrush transient current at full load and 48 Vin with
PC enabled
Figure 2—
Output voltage turn-on waveform with PC enabled
at full load and 48 Vin
Figure 3—Output
voltage turn-on waveform with input turn-on
at full load and 48 Vin
Figure 4—
Input reflected ripple current at full load and 48 Vin
45
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Bus Converter
B048K120T20
Rev. 2.2
Page 2 of 16
Specifications, continued
OUTPUT
(Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Rated DC current
Peak repetitive current
DC current limit
Current share accuracy
Efficiency
10A load
Full load
Internal output inductance
Internal output capacitance
Load capacitance
Output overvoltage setpoint
Output ripple voltage
No external bypass
1µF bypass capacitor
Average short circuit current
Effective switching frequency
Line regulation
K
Load regulation
R
OUT
Transient response
Voltage overshoot
Response time
Recovery time
Output overshoot
Input turn-on
PC enable
Output turn-on delay
From application of power
From release of PC pin
17.0
21.0
5
96.2
95.7
1.6
12
1000
14.75
95
12
200
3.5
0.250
150
Min
0
Typ
Max
17.0
25.0
26.0
10
Unit
Adc
A
Adc
%
%
%
nH
µF
µF
Vdc
mV
mV
mA
MHz
Note
Max pulse width 1ms, max duty cycle 10%,
baseline power 50%
See Parallel Operation on page 12
See Fig.5
See Fig.5
Effective value
95.5
95.0
See Figs.7 and 9
See Fig.8
Fixed, 1.75 MHz per phase
V
OUT
=K•V
IN
at no load
2.8
0.245
4.2
0.255
25
mΩ
mV
mV
ns
µs
mV
mV
See Fig. 26
0-17.0A load step, see Fig.10
1.2-15A load step with 1µF bypass, see Fig. 11
See Figs.10 and 11
See Figs.10 and 11
No output filter; See Fig.3
No output filter; See Fig.2
No output filter; See Fig.3
No output filter; See Fig.2
230
40
200
1
0
0
250
50
ms
ms
OUTPUT WAVEFORMS
Efficiency vs. Output Power
97
96
95
10
9
Power Dissipation
Power Dissipation (W)
0
25
50
75
100
125
150
175
200
8
7
6
5
4
3
2
1
0
0
25
50
75
100
125
150
175
200
Efficiency (%)
94
93
92
91
90
89
Output Power (W)
Output Power (W)
Figure 5—
Efficiency vs. output power at 12 Vout
Figure 6—Power
dissipation as a function of output power
45
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Bus Converter
B048K120T20
Rev. 2.2
Page 3 of 16
Specifications, continued
Figure 7—
Output voltage ripple at full load and 48 Vin;
without any external bypass capacitor.
Figure 8—Output
voltage ripple at full load and nominal Vin
with 1 µF ceramic external bypass capacitor.
V
OUT
I
OUT
7 A/div
Figure 9—
Output voltage ripple vs. output power at 48 Vin
without any external bypass capacitor.
Figure 10—
0-17 A load step with 100 µF input capacitance and
no output capacitance.
V
OUT
I
OUT
7 A/div
Figure 11—
17-0A load step with 100 µF input capacitance and
no output capacitance.
45
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Bus Converter
B048K120T20
Rev. 2.2
Page 4 of 16
Specifications, continued
GENERAL
Parameter
MTBF
MIL-HDBK-217F
Telcordia TR-NT-000332
Telcordia SR-332
Demonstrated
Isolation specifications
Voltage
Capacitance
Resistance
Agency approvals (pending)
Mechanical parameters
Weight
Dimensions
Length
Width
Height
Min
Typ
3.6
4.2
TBD
TBD
2,250
5,000
10
cTÜVus
CE Mark
0.5 / 14
1.26 / 32
0.85 / 21.5
0.24 / 6
oz / g
in / mm
in / mm
in / mm
6,500
Max
Unit
Mhrs
Mhrs
hrs
hrs
Vdc
pF
MΩ
Note
25°C, GB
Input to Output
Input to Output
Input to Output
UL/CSA 60950, EN 60950
Low Voltage Directive
See mechanical drawing, Figs.15 and 17
Auxiliary Pins
(Conditions are at nominal line, full load, and 25°C ambient unless otherwise specified)
Parameter
Primary control (PC)
DC voltage
Module disable voltage
Module enable voltage
Current limit
Enable delay time
Disable delay time
Temperature Monitor (TM)
27°C setting
Temperature coefficient
Full range accuracy
Current limit
Min
4.8
2.4
2.4
Typ
5.0
2.5
2.5
2.5
50
4
3.00
10
±5
Max
5.2
2.6
2.9
10
3.05
Unit
V
V
V
mA
ms
µs
V
mV/°C
°C
µA
Note
Source only
See Fig.2
See Fig.12
Operating junction temperature
Operating junction temperature
Source only
2.95
100
Figure 12—
V
OUT
at full load vs. PC disable
Figure 13—
PC signal during fault
45
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Bus Converter
B048K120T20
Rev. 2.2
Page 5 of 16
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