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XSFP10630500C

Description
RES,SMT,THIN FILM,3.05K OHMS,100WV,.2% +/-TOL,-100,100PPM TC,0202 CASE
CategoryPassive components    The resistor   
File Size84KB,3 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

XSFP10630500C Overview

RES,SMT,THIN FILM,3.05K OHMS,100WV,.2% +/-TOL,-100,100PPM TC,0202 CASE

XSFP10630500C Parametric

Parameter NameAttribute value
Objectid1220423115
package instructionSMT, 0202
Reach Compliance Codeunknown
Country Of OriginUSA
ECCN codeEAR99
YTEOL8.5
structureChip
Manufacturer's serial numberSFP
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height0.254 mm
Package length0.558 mm
Package formSMT
Package width0.558 mm
method of packingTray
Rated power dissipation(P)0.25 W
GuidelineMIL-STD-883
resistance3050 Ω
Resistor typeFIXED RESISTOR
seriesSFP
size code0202
technologyTHIN FILM
Temperature Coefficient100 ppm/°C
Tolerance0.2%
Operating Voltage100 V
SFP
Vishay Electro-Films
CHIP
RESISTORS
Thin Film Top-Contact Resistor
with Part Mark
FEATURES
Wire bondable
Product may not
be to scale
Part marked - 5 digits
Small size: 0.022 inches square
Resistance range: 1
Ω
to 1 MΩ
DC power rating: 250 mW
Oxidized silicon substrate for good power dissipation
Resistor material: Tantalum nitride, self passivating
Moisture resistant
The SFP series single-value resistor chips offer a small size,
wide ohmic value range and excellent power capacity.
The SFPs are part marked with resistance value allowing
user the ability to visually determine the resistance value of
the chip.
The SFPs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology.
The SFPs are 100 % electrically tested and visually
inspected to MIL-STD-883.
APPLICATIONS
Vishay EFI SFP small resistor chips are widely used in hybrid packages where space is limited and chip value marking is
important for identification. The die is part marked with the resistance value. Wire bonding is made to the two pads on the top of
the chip.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
1%
0.5 %
PROCESS CODE
0.1 %
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
CLASS H*
103
102
101
100
CLASS K*
108
107
106
105
1
Ω
10
Ω
30
Ω
100
Ω
200 k
Ω
430 k
Ω
620 k
Ω
1 M
Ω
* MIL-PRF-38534 inspection criteria
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100
Ω
- 250 kΩ
< 100
Ω
or > 251 kΩ
Moisture Resistance, MIL-STD-202
Method 106
Stability, 1000 h, + 125 °C, 125 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
Values above 1M available
www.vishay.com
40
For technical questions, contact: ff2bresistors@vishay.com
Document Number: 61000
Revision: 07-Mar-08
- 35 dB typ.
- 20 dB typ.
± 0.5 % max.
ΔR/R
± 0.25 % max.
ΔR/R
- 55 °C to + 125 °C
± 0.25 % max.
ΔR/R
± 0.5 % max.
ΔR/R
200 V
10
12
min.
100 V max.
250 mW
± 0.25 % max.
ΔR/R
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