BR93G76FVJ-3BE2 datasheet, PDF

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BR93G76FVJ-3BE2: DescriptionSerial EEPROM series Standard EEPROM MicroWire BUS EEPROM (3-Wire); File Size939KB，39 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/

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BR93G76FVJ-3BE2 Overview

Serial EEPROM series Standard EEPROM MicroWire BUS EEPROM (3-Wire)

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Datasheet

Serial EEPROM series Standard EEPROM

MicroWire BUS EEPROM (3-Wire)

BR93G76-3

●General

Description

BR93G76-3 is serial EEPROM of serial 3-line Interface method.

They are dual organization(by 16bit or 8bit) and it is selected by the input of ORG PIN.

●Features

■

3-line communications of chip select, serial clock,

serial data input / output (the case where input and

output are shared)

■

Operations available at high speed 3MHz clock

(4.5 V~5.5 V)

■

High speed write available (write time 5ms max.）

■

Same package and pin configuration from 1Kbit to

16Kbit

■

1.7~5.5V single power source operation

■

Address auto increment function at read operation

■

Write mistake prevention function

» Write prohibition at power on

» Write prohibition by command code

» Write mistake prevention function at low voltage

■

Self-timed programming cycle

■

Program condition display by READY / BUSY

■

Dual organization : by 16 bit (X16) or 8 bit (X8)

■

Compact package

SOP8/SOP-J8/SSOP-B8/TSSOP-B8/MSOP8/

TSSOP-B8J/DIP-T8/VSON008X2030

■

More than 40 years data retention

■

More than 1 million write cycles

■

Initial delivery state all addresses FFFFh (X16) or

FFh (X8)

●Packages

W(Typ.) x D(Typ.)x H(Max.)

DIP-T8

9.30mm x 6.50mm x 7.10mm

TSSOP-B8

3.00mm x 6.40mm x 1.20mm

SOP8

5.00mm x 6.20mm x 1.71mm

TSSOP-B8J

3.00mm x 4.90mm x 1.10mm

SOP- J8

4.90mm x 6.00mm x 1.65mm

MSOP8

2.90mm x 4.00mm x 0.90mm

SSOP-B8

3.00mm x 6.40mm x 1.35mm

VSON008X2030

2.00mm x 3.00mm x 0.60mm

●BR93G76-3

Capacity

8Kbit

Bit format

512×16 or1024×8

Type

BR93G76-3

Power source

DIP-T8

SOP8

voltage

1.7

5.5V

SOP-J8

SSOP-B8 TSSOP-B8

TSSOP-B8J MSOP8

VSON008

X2030

●

*1 DIP-T8 is not halogen free package

○Product

structure：Silicon monolithic integrated circuit

www.rohm.com

TSZ22111・14・001

○This

product is not designed protection against radioactive rays

1/36

TSZ02201-09190G100070-1-2

07.JAN.2013 REV.001

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