Description
Mechanical Dimensions
BZT52C2V4~C39
SOD-123
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*
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Dimensions in mm
Features:
Planar Die Construction
500mW Power Dissipation on Ceramic PCB
General Purpose Medium Current
Ideally Suited for Automated Assembly Process
Symbol
VF
Pd
Rthja
Tj/Tstg
Value
0.9
500
305
-65 ~ +150
Unit
V
mW
C/W
C
Characteristic
Forward Voltage @ If=10mA
Power Dissipation
Thermal Resistance, Junction to Ambient air
Operating and Storage Temperature Range