BL
Galaxy Electrical
Surface mount zener diode
FEATURES
Planar die construction.
General purpose, medium current.
Production specification
BZT52C2V0S-BZT52C39S
Pb
Lead-free
Ideally suited for automated assembly processes.
APPLICATIONS
Zener diode.
Ultra-small surface mount package.
ORDERING INFORMATION
Type No.
BZT52C2V4S-BZT52C51S
Marking
See table 2
SOD-323
Package Code
SOD-323
MAXIMUM RATING
@ Ta=25℃ unless otherwise specified
Characteristic
Forward Voltage
Power Dissipation
Thermal resistance,junction to ambient air
Junction temperature
Storage temperature range
@ I
F
=10mA
Symbol
V
F
P
d
R
θjA
T
j
T
stg
Value
0.9
200
625
150
-65-150
Unit
V
mW
℃/W
℃
℃
Notes: 1. Valid provided that device terminals are kept at ambient temperature.
2. Short duration test pulse used in minimize self-heating effect.
3. f = 1KHz.
ELECTRICAL CHARACTERISTICS
@ Ta=25℃ unless otherwise specified
Document number: BL/SSZDB019
Rev.A
www.galaxycn.com
1
BL
Galaxy Electrical
Surface mount zener diode
Zener Voltage Range
V
Z
@I
ZT
Nom(V)
BZT52C2V0S
BZT52C2V4S
BZT52C2V7S
BZT52C3V0S
BZT52C3V3S
BZT52C3V6S
BZT52C3V9S
BZT52C4V3S
BZT52C4V7S
BZT52C5V1S
BZT52C5V6S
BZT52C6V2S
BZT52C6V8S
BZT52C7V5S
BZT52C8V2S
BZT52C9V1S
BZT52C10S
BZT52C11S
BZT52C12S
BZT52C13S
BZT52C15S
BZT52C16S
BZT52C18S
BZT52C20S
BZT52C22S
BZT52C24S
BZT52C27S
BZT52C30S
BZT52C33S
BZT52C36S
BZT52C39S
WY
WX
W1
W2
W3
W4
W5
W6
W7
W8
W9
WA
WB
WC
WD
WE
WF
WG
WH
WI
WJ
WK
WL
WM
WN
WO
WP
WQ
WR
WS
WT
2.0
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
Min(V)
1.91
2.2
2.5
2.8
3.1
3.4
3.7
4.0
4.4
4.8
5.2
5.8
6.4
7.0
7.7
8.5
9.4
10.4
11.4
12.4
13.8
15.3
16.8
18.8
20.8
22.8
25.1
28.0
31.0
34.0
37.0
Max(V)
2.09
2.60
2.9
3.2
3.5
3.8
4.1
4.6
5.0
5.4
6.0
6.6
7.2
7.9
8.7
9.6
10.6
11.6
12.7
14.1
15.6
17.1
19.1
21.2
23.3
25.6
28.9
32.0
35.0
38.0
41.0
I
ZT
mA
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
2
2
2
2
2
100
100
100
95
95
90
90
90
80
60
40
10
15
15
15
15
20
20
25
30
30
40
45
55
55
70
80
80
80
90
130
Maximum Zener
Impedance
Z
ZT
@I
ZT
Ω
600
600
600
600
600
600
600
600
500
480
400
150
80
80
80
100
150
150
150
170
200
200
225
225
250
250
300
300
325
350
350
Z
ZK
@I
ZK
I
ZK
mA
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.5
0.5
0.5
0.5
0.5
Production specification
BZT52C2V0S-BZT52C39S
Maximum
Reverse
Current
I
R
μA
150
50
20
10
5
5
3
3
3
2
1
3
2
1
0.7
0.5
0.2
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
@V
R
V
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
2.0
4.0
4.0
5.0
5.0
6.0
7.0
8.0
8.0
8.0
10.5
11.2
12.6
14.0
15.4
16.8
18.9
21.0
23.1
25.2
27.3
Temperature
Coefficient of
zener voltage @
I
ZTC
mV/℃
Min
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-2.7
-2.0
0.4
1.2
2.5
3.2
3.8
4.5
5.4
6.0
7.0
9.2
10.4
12.4
14.4
16.4
18.4
21.4
24.4
27.4
30.4
33.4
Max
0
0
0
0
0
0
0
0
0.2
1.2
2.5
3.7
4.5
5.3
6.2
7.0
8.0
9.0
10.0
11.0
13.0
14.0
16.0
18.0
20.0
22.0
25.3
29.4
33.4
37.4
41.2
Type Number
Marking
Code
Notes: 1. Valid provided that device terminals are kept at ambient temperature.
2. Tested with pulses, period=5ms, pulse width = 300μs.
3. f = 1KHz.
Document number: BL/SSZDB019
Rev.A
www.galaxycn.com
2
BL
Galaxy Electrical
Surface mount zener diode
Production specification
BZT52C2V0S-BZT52C39S
TYPICAL CHARACTERISTICS
@ Ta=25℃ unless otherwise specified
Document number: BL/SSZDB019
Rev.A
www.galaxycn.com
3
BL
Galaxy Electrical
Surface mount zener diode
PACKAGE OUTLINE
Plastic surface mounted package
Production specification
BZT52C2V0S-BZT52C39S
SOD-323
SOD-323
K
B
C
Dim
A
Min
1.275
1.675
Max
1.325
1.725
D
A
B
C
D
E
H
0.9 Typical
0.25
0.27
0.02
0.35
0.37
0.1
J
E
H
J
K
0.1 Typical
2.6
2.7
All Dimensions in mm
SOLDERING FOOTPRINT
Unit : mm
PACKAGE
Device
INFORMATION
Package
SOD-323
Shipping
3000/Tape&Reel
BZT52C2V0S-BZT52C39S
Document number: BL/SSZDB019
Rev.A
www.galaxycn.com
4
FPGA/CPLD
京公网安备 11010802033920号
EEWORLD
