Chipcon
SmartRF
â
CC1010
CC1010
Single Chip Very Low Power RF Transceiver with
8051-Compatible Microcontroller
Applications
•
Very low power UHF wireless data
transmitters and receivers
•
315 / 433 / 868 and 915 MHz ISM/SRD
band systems
•
Home automation and security
•
AMR – Automatic Meter Reading
•
RKE – Remote Keyless Entry with
acknowledgement
•
Low power telemetry
•
Toys
Product Description
The
CC1010
is a true single-chip UHF
transceiver with an integrated high
performance 8051 microcontroller with 32
kB of Flash program memory. The RF
transceiver can be programmed for
operation in the 300 – 1000 MHz range,
and is designed for very low power
wireless applications.
The
CC1010
together with a few external
passive
components
constitutes
a
powerful embedded system with wireless
communication capabilities.
CC1010
is
â
SmartRF 02
CMOS.
based
on
technology in
Chipcon’s
0.35
µm
Key Features
•
300-1000 MHz RF Transceiver
•
Very low current consumption
•
High sensitivity (typically -107 dBm)
•
Programmable output power up to
+10 dBm
•
Data rate up to 76.8 kbit/s
•
Very few external components
•
Fast PLL settling allowing frequency
hopping protocols
•
RSSI
•
EN 300 220 and FCC CFR47 part
15 compliant
•
8051-Compatible Microcontroller
•
Typically 2.5 times the performance
of a standard 8051
•
32 kB Flash, 2048 + 128 Byte SRAM
•
3 channel 10 bit ADC, 4 timers / 2
PWMs, 2 UARTs, RTC, Watchdog,
SPI, DES encryption, 26 general I/O
pins
•
In-circuit interactive debugging is
supported for the Keil
µVision2
IDE
through a simple serial interface.
•
2.7 - 3.6 V supply voltage
•
64-lead TQFP
This document contains information on a preproduction product. Specifications and information herein are subject to
change without notice.
Chipcon AS
SmartRF
â
CC1010
PRELIMINARY Datasheet (rev. 1.0) 2002-09-18
Page 1 of 133
Chipcon
Table Of Contents
SmartRF
â
CC1010
FEATURES ............................................................................................................................................ 4
ABSOLUTE MAXIMUM RATINGS .................................................................................................. 5
RECOMMENDED OPERATING CONDITIONS............................................................................. 5
DC CHARACTERISTICS.................................................................................................................... 6
ELECTRICAL SPECIFICATIONS .................................................................................................... 7
PIN CONFIGURATION..................................................................................................................... 11
PIN DESCRIPTION............................................................................................................................ 13
BLOCK DIAGRAM ............................................................................................................................ 16
8051 CORE........................................................................................................................................... 17
G
ENERAL DESCRIPTION
...................................................................................................................... 17
R
ESET
................................................................................................................................................. 17
M
EMORY
M
AP
.................................................................................................................................... 18
CPU R
EGISTERS
................................................................................................................................. 21
I
NSTRUCTION
S
ET
S
UMMARY
............................................................................................................. 22
I
NTERRUPTS
........................................................................................................................................ 26
M
AIN
C
RYSTAL
O
SCILLATOR
............................................................................................................. 30
P
OWER AND
C
LOCK
M
ODES
............................................................................................................... 31
F
LASH
P
ROGRAM
M
EMORY
................................................................................................................ 34
SPI F
LASH
P
ROGRAMMING
................................................................................................................. 34
8051 F
LASH
P
ROGRAMMING
.............................................................................................................. 39
F
LASH
P
OWER
C
ONTROL
.................................................................................................................... 40
I
N
C
IRCUIT
D
EBUGGING
..................................................................................................................... 41
C
HIP
V
ERSION
/ R
EVISION
.................................................................................................................. 42
8051 PERIPHERALS .......................................................................................................................... 43
G
ENERAL
P
URPOSE
I/O....................................................................................................................... 43
T
IMER
0 / T
IMER
1.............................................................................................................................. 48
T
IMER
2 / 3
WITH
PWM ..................................................................................................................... 54
P
OWER
O
N
R
ESET
(B
ROWN
-O
UT
D
ETECTION
) ................................................................................... 57
W
ATCHDOG
T
IMER
............................................................................................................................. 58
R
EALTIME
C
LOCK
............................................................................................................................... 61
S
ERIAL
P
ORT
0
AND
1 ......................................................................................................................... 62
SPI M
ASTER
....................................................................................................................................... 67
DES E
NCRYPTION
/ D
ECRYPTION
....................................................................................................... 70
R
ANDOM
B
IT
G
ENERATION
................................................................................................................ 74
ADC................................................................................................................................................... 75
RF TRANSCEIVER ............................................................................................................................ 78
G
ENERAL DESCRIPTION
...................................................................................................................... 78
RF T
RANSCEIVER
B
LOCK
D
IAGRAM
.................................................................................................. 78
RF A
PPLICATION
C
IRCUIT
.................................................................................................................. 80
T
RANSCEIVER
C
ONFIGURATION
O
VERVIEW
....................................................................................... 83
RF T
RANSCEIVER
RX/TX
CONTROL AND POWER MANAGEMENT
....................................................... 84
D
ATA
M
ODEM AND
D
ATA
M
ODES
...................................................................................................... 86
B
AUDRATES
........................................................................................................................................ 89
T
RANSMITTING AND RECEIVING DATA
................................................................................................ 90
D
EMODULATION AND DATA DECISION
................................................................................................ 92
S
YNCHRONIZATION AND PREAMBLE DETECTION
................................................................................ 96
R
ECEIVER SENSITIVITY VERSUS DATA RATE AND FREQUENCY SEPARATION
....................................... 99
F
REQUENCY PROGRAMMING
............................................................................................................. 100
L
OCK
I
NDICATION
............................................................................................................................ 102
R
ECOMMENDED
S
ETTINGS FOR
ISM F
REQUENCIES
.......................................................................... 103
VCO................................................................................................................................................. 105
Chipcon AS
SmartRF
â
CC1010
PRELIMINARY Datasheet (rev. 1.0) 2002-09-18
Page 2 of 133
Chipcon
SmartRF
â
CC1010
VCO
AND
PLL
SELF
-
CALIBRATION
.................................................................................................. 105
VCO, LNA
AND BUFFER CURRENT CONTROL
................................................................................... 110
I
NPUT
/ O
UTPUT
M
ATCHING
............................................................................................................. 112
O
UTPUT
P
OWER
P
ROGRAMMING
...................................................................................................... 113
RSSI O
UTPUT
................................................................................................................................... 115
IF
OUTPUT
....................................................................................................................................... 116
O
PTIONAL
LC F
ILTER
....................................................................................................................... 117
R
ESERVED REGISTERS AND TEST REGISTERS
..................................................................................... 118
S
YSTEM
C
ONSIDERATIONS AND
G
UIDELINES
.................................................................................... 120
PCB L
AYOUT
R
ECOMMENDATIONS
.................................................................................................. 122
A
NTENNA
C
ONSIDERATIONS
............................................................................................................ 122
PACKAGE DESCRIPTION (TQFP-64) ......................................................................................... 123
SOLDERING INFORMATION....................................................................................................... 124
TRAY SPECIFICATION ................................................................................................................. 124
CARRIER TAPE AND REEL SPECIFICATION ......................................................................... 124
LIST OF ABBREVIATIONS ........................................................................................................... 125
SFR SUMMARY................................................................................................................................ 126
ALPHABETIC REGISTER INDEX................................................................................................ 130
ORDERING INFORMATION......................................................................................................... 133
Chipcon AS
SmartRF
â
CC1010
PRELIMINARY Datasheet (rev. 1.0) 2002-09-18
Page 3 of 133
Chipcon
Features
•
Fully Integrated UHF RF Transceiver
•
Programmable frequency in the
range 300 – 1000 MHz
•
High sensitivity (typically -107 dBm
at 2.4 kBaud)
•
Programmable output power –20 to
+10 dBm
•
Very low current consumption (RX:
9.1 mA)
•
Very few external components
required and no external RF switch
or IF filter required
•
Single port antenna connection
•
Fast PLL settling allows frequency
hopping protocols
•
FSK modulation with a data rate of
up to 76.8 kBaud
•
Manchester or NRZ coding and
decoding of data performed in
hardware. Byte delineation of data
can be performed in hardware to
lessen the processor burden
•
RSSI output which can be sampled
by on-chip ADC
•
Complies with EN 300 220 and FCC
CFR47 part 15
•
High-Performance and Low-Power
8051-Compatible Microcontroller
•
Optimised 8051-core which typically
gives 2.5x the performance of a
standard 8051
•
Dual data pointers
•
Idle and sleep modes
•
In-circuit interactive debugging is
supported for the Keil
µVision
IDE
through a simple serial interface
•
Data and Nonvolatile Program Memory
•
32 kB of nonvolatile Flash memory
in-system programmable through a
simple SPI interface or by the 8051
core.
•
Typical Flash memory endurance:
20 000 write/erase cycles
SmartRF
â
CC1010
•
•
•
•
•
•
Programmable read and write lock of
portions of Flash memory for software
security
•
2048 + 128 Byte of internal SRAM
Hardware
DES
Encryption
/
Decryption
•
DES supported in hardware
•
Output Feedback Mode or Cipher
Feedback Mode DES to avoid the
requirement that data length must
be a multiple of eight bytes
Peripheral Features
•
Power On Reset / Brown-Out
Detection
•
Three channel, max 23 kSample/s,
10 bit ADC
•
Programmable watchdog timer.
•
Real time clock with 32 kHz crystal
oscillator
•
Two timers / pulse counters and two
timers / pulse width modulators
•
Two programmable serial UARTs.
•
Master SPI interface
•
26 configurable general-purpose
I/O-pins
•
Random bit generator in hardware
Low Power
•
8051 core and peripherals can use
the RTC's 32 kHz clock
•
Idle and sleep modes for reduced
power consumption. System can
wake up on interrupt or when ADC
input exceeds a set threshold
•
Low-power fully static CMOS design
Operating Conditions
•
2.7 - 3.6 V supply voltage
•
-40 - 85
°C
operational temperature
•
3 - 24 MHz crystal (up to 50 ppm)
for the main crystal oscillator
Packaging
•
64-lead TQFP
Chipcon AS
SmartRF
â
CC1010
PRELIMINARY Datasheet (rev. 1.0) 2002-09-18
Page 4 of 133
Chipcon
Absolute Maximum Ratings
SmartRF
â
CC1010
Under no circumstances must the absolute maximum ratings given in Table 1 be violated.
Stress exceeding one or more of the limiting values may cause permanent damage to the
device.
Table 1. Absolute Maximum Ratings
Parameter
Supply voltage, VDD
Voltage on any pin
Input RF level
Storage temperature range
Storage temperature range
Lead temperature
Min.
-0.3
-0.3
-50
-40
Max.
5.0
VDD+0.3,
max 5.0
10
150
125
260
Units
V
V
dBm
°C
°C
°C
Condition
Un-programmed device
Programmed device, data
retention > 0.49 years at
125°C
T = 10 s
Caution!
ESD sensitive device.
Precaution should be used when handling
the device in order to prevent permanent
damage.
Recommended Operating Conditions
Table 2. Recommended Operating Conditions
Tc = -40 to 85°C, VDD = 2.7 to 3.6 V if nothing else stated
Parameter
Supply voltage, DVDD, AVDD
Min
Typ
3.3
Max
Unit
V
Condition
Supply voltage during
normal operation
Supply voltage during
program/erase Flash
memory
2.7
Supply voltage, DVDD, AVDD
2.7
3.6
3.6
V
V
Operating temperature, free-air
Main oscillator frequency
RTC oscillator frequency
-40
3
32768
85
24
°C
MHz
kHz
Chipcon AS
SmartRF
â
CC1010
PRELIMINARY Datasheet (rev. 1.0) 2002-09-18
Page 5 of 133
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