|
Z8523010LMB |
Z8523008CMB |
Z8523016LMB |
Z8523010CMB |
Z8523016CMB |
Z8523008LMB |
| Description |
Serial I/O Controller, 2 Channel(s), CMOS, CQCC44, CERAMIC, LCC-44 |
Serial I/O Controller, 2 Channel(s), CMOS, CDIP40, SIDE BRAZED, CERDIP-40 |
Serial I/O Controller, 2 Channel(s), CMOS, CQCC44, CERAMIC, LCC-44 |
Serial I/O Controller, 2 Channel(s), CMOS, CDIP40, SIDE BRAZED, CERDIP-40 |
Serial I/O Controller, 2 Channel(s), CMOS, CDIP40, SIDE BRAZED, CERDIP-40 |
Serial I/O Controller, 2 Channel(s), CMOS, CQCC44, CERAMIC, LCC-44 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
Zilog, Inc. |
Zilog, Inc. |
Zilog, Inc. |
Zilog, Inc. |
Zilog, Inc. |
Zilog, Inc. |
| Parts packaging code |
LCC |
DIP |
LCC |
DIP |
DIP |
LCC |
| package instruction |
QCCN, LCC44(UNSPEC) |
DIP, DIP40,.6 |
QCCN, LCC44(UNSPEC) |
DIP, DIP40,.6 |
DIP, DIP40,.6 |
QCCN, LCC44(UNSPEC) |
| Contacts |
44 |
40 |
44 |
40 |
40 |
44 |
| Reach Compliance Code |
unknow |
unknown |
unknown |
unknow |
unknow |
unknown |
| Other features |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO |
MODEM CONTROL I/OS USABLE AS GP I/OS; 10 X 19 FRAME STATUS FIFO; ICC SPECIFIED @ 8.5MHZ |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO |
MODEM CONTROL I/OS USABLE AS GP I/OS; 10 X 19 FRAME STATUS FIFO; ICC SPECIFIED @ 8.5MHZ |
| boundary scan |
NO |
NO |
NO |
NO |
NO |
NO |
| maximum clock frequency |
10 MHz |
8 MHz |
16.384 MHz |
10 MHz |
16.384 MHz |
8 MHz |
| letter of agreement |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
| Data encoding/decoding methods |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
| External data bus width |
8 |
8 |
8 |
8 |
8 |
8 |
| JESD-30 code |
S-CQCC-N44 |
R-CDIP-T40 |
S-CQCC-N44 |
R-CDIP-T40 |
R-CDIP-T40 |
S-CQCC-N44 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
| low power mode |
NO |
NO |
NO |
NO |
NO |
NO |
| Number of serial I/Os |
2 |
2 |
2 |
2 |
2 |
2 |
| Number of terminals |
44 |
40 |
44 |
40 |
40 |
44 |
| Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
| Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
QCCN |
DIP |
QCCN |
DIP |
DIP |
QCCN |
| Encapsulate equivalent code |
LCC44(UNSPEC) |
DIP40,.6 |
LCC44(UNSPEC) |
DIP40,.6 |
DIP40,.6 |
LCC44(UNSPEC) |
| Package shape |
SQUARE |
RECTANGULAR |
SQUARE |
RECTANGULAR |
RECTANGULAR |
SQUARE |
| Package form |
CHIP CARRIER |
IN-LINE |
CHIP CARRIER |
IN-LINE |
IN-LINE |
CHIP CARRIER |
| power supply |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Filter level |
38535Q/M;38534H;883B |
38535Q/M;38534H;883B |
38535Q/M;38534H;883B |
38535Q/M;38534H;883B |
38535Q/M;38534H;883B |
38535Q/M;38534H;883B |
| Maximum seat height |
2.286 mm |
4.699 mm |
2.286 mm |
4.699 mm |
4.699 mm |
2.286 mm |
| Maximum slew rate |
18 mA |
15 mA |
22 mA |
18 mA |
22 mA |
15 mA |
| Maximum supply voltage |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| surface mount |
YES |
NO |
YES |
NO |
NO |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
NO LEAD |
THROUGH-HOLE |
NO LEAD |
THROUGH-HOLE |
THROUGH-HOLE |
NO LEAD |
| Terminal pitch |
1.27 mm |
2.54 mm |
1.27 mm |
2.54 mm |
2.54 mm |
1.27 mm |
| Terminal location |
QUAD |
DUAL |
QUAD |
DUAL |
DUAL |
QUAD |
| width |
16.51 mm |
15.24 mm |
16.51 mm |
15.24 mm |
15.24 mm |
16.51 mm |
| uPs/uCs/peripheral integrated circuit type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |