IC 8-BIT, OTPROM, 8 MHz, MICROCONTROLLER, PDSO18, SOIC-18, Microcontroller
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Maker | Zilog, Inc. |
| Parts packaging code | SOIC |
| package instruction | SOP, |
| Contacts | 18 |
| Reach Compliance Code | unknow |
| Has ADC | NO |
| Address bus width | |
| bit size | 8 |
| maximum clock frequency | 8 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | |
| JESD-30 code | R-PDSO-G18 |
| JESD-609 code | e3 |
| length | 11.55 mm |
| Number of I/O lines | 14 |
| Number of terminals | 18 |
| Maximum operating temperature | 105 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 225 |
| Certification status | Not Qualified |
| ROM programmability | OTPROM |
| speed | 8 MHz |
| Maximum slew rate | 15 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 7.5 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| Z86E0408SEG | Z86E0408PEG | |
|---|---|---|
| Description | IC 8-BIT, OTPROM, 8 MHz, MICROCONTROLLER, PDSO18, SOIC-18, Microcontroller | IC 8-BIT, OTPROM, 8 MHz, MICROCONTROLLER, PDIP18, DIP-18, Microcontroller |
| Is it lead-free? | Lead free | Lead free |
| Maker | Zilog, Inc. | Zilog, Inc. |
| Parts packaging code | SOIC | DIP |
| package instruction | SOP, | DIP, |
| Contacts | 18 | 18 |
| Reach Compliance Code | unknow | unknown |
| Has ADC | NO | NO |
| bit size | 8 | 8 |
| maximum clock frequency | 8 MHz | 8 MHz |
| DAC channel | NO | NO |
| DMA channel | NO | NO |
| JESD-30 code | R-PDSO-G18 | R-PDIP-T18 |
| JESD-609 code | e3 | e3 |
| length | 11.55 mm | 22.86 mm |
| Number of I/O lines | 14 | 14 |
| Number of terminals | 18 | 18 |
| Maximum operating temperature | 105 °C | 105 °C |
| Minimum operating temperature | -40 °C | -40 °C |
| PWM channel | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | 225 | 225 |
| Certification status | Not Qualified | Not Qualified |
| ROM programmability | OTPROM | OTPROM |
| speed | 8 MHz | 8 MHz |
| Maximum slew rate | 15 mA | 15 mA |
| Maximum supply voltage | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V |
| surface mount | YES | NO |
| technology | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | TIN | TIN |
| Terminal form | GULL WING | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 |
| width | 7.5 mm | 7.62 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER |
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