EEWORLDEEWORLDEEWORLD

Part Number

Search

0603YA470JA79A

Description
Ceramic Capacitor, Multilayer, Ceramic, 16V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.000047uF, Surface Mount, 0603, CHIP
CategoryPassive components    capacitor   
File Size83KB,4 Pages
ManufacturerAVX
Environmental Compliance  
Download Datasheet Parametric View All

0603YA470JA79A Overview

Ceramic Capacitor, Multilayer, Ceramic, 16V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.000047uF, Surface Mount, 0603, CHIP

0603YA470JA79A Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerAVX
package instruction, 0603
Reach Compliance Codecompli
ECCN codeEAR99
capacitance0.000047 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high0.9 mm
JESD-609 codee4
length1.6 mm
Manufacturer's serial number0603
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance5%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingBULK
positive tolerance5%
Rated (DC) voltage (URdc)16 V
seriesSIZE(C0G)
size code0603
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient-/+30ppm/Cel ppm/°C
Terminal surfaceGold (Au)
Terminal shapeWRAPAROUND
width0.81 mm
C0G (NP0) Dielectric
General Specifications
C0G (NP0) is the most popular formulation of the
“temperature-compensating,” EIA Class I ceramic
materials. Modern C0G (NP0) formulations contain
neodymium, samarium and other rare earth oxides.
C0G (NP0) ceramics offer one of the most stable capacitor
dielectrics available. Capacitance change with temperature
is 0 ±30ppm/°C which is less than ±0.3% C from -55°C
to +125°C. Capacitance drift or hysteresis for C0G (NP0)
ceramics is negligible at less than ±0.05% versus up to
±2% for films. Typical capacitance change with life is less
than ±0.1% for C0G (NP0), one-fifth that shown by most
other dielectrics. C0G (NP0) formulations show no aging
characteristics.
PART NUMBER (see page 2 for complete part number explanation)
0805
Size
(L" x W")
5
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
500V = 7
A
Dielectric
C0G (NP0) = A
101
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
J
Capacitance
Tolerance
±.10 pF (<10pF)
±.25 pF (<10pF)
±.50 pF (<10pF)
±1% (≥ 10 pF)
±2% (≥ 10 pF)
±5%
±10%
A
Failure
Rate
A = Not
Applicable
T
2
A
Special
Code
A = Std.
Product
B
C
D
F
G
J
K
=
=
=
=
=
=
=
Terminations
Packaging
2 = 7" Reel
T = Plated Ni
4 = 13" Reel
and Sn
7 = Bulk Cass.
7 = Gold Plated
9 = Bulk
Contact
Contact
Factory For
Factory
1 = Pd/Ag Term
For
Multiples
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Contact factory for non-specified capacitance values.
Insulation Resistance (Ohm-Farads)
Temperature Coefficient
Typical Capacitance Change
Envelope: 0
±
30 ppm/°C
Capacitance vs. Frequency
+2
Insulation Resistance vs Temperature
10,000
Capacitance
Capacitance
+1
0
-1
-2
1,000
+0.5
0
-0.5
100
%
%
-55 -35 -15 +5 +25 +45 +65 +85 +105 +125
1KHz
10 KHz
100 KHz
1 MHz
10 MHz
0
0
20
40
60
80
100
Temperature
°C
Variation of Impedance with Cap Value
Impedance vs. Frequency
0805 - C0G (NP0)
10 pF vs. 100 pF vs. 1000 pF
100,000
Frequency
Variation of Impedance with Chip Size
Impedance vs. Frequency
1000 pF - C0G (NP0)
10
1206
0805
1812
1210
1.0
10.00
Temperature
°C
Variation of Impedance with Ceramic Formulation
Impedance vs. Frequency
1000 pF - C0G (NP0) vs X7R
0805
X7R
NPO
10,000
100
10.0
10 pF
Impedance,
1000
Impedance,
1,000
Impedance,
1.00
0.10
1.0
0.1
1
10
100
100 pF
1000 pF
1000
0.1
10
100
Frequency, MHz
0.01
10
100
1000
Frequency, MHz
Frequency, MHz
4
【Transfer】 LPC2214fbd144, 144pin chip left over from the project, 10 yuan per piece, a total of 26 pieces
[Transfer] The remaining LPC2214fbd144, 144pin chips from the project, 10 yuan each, 26 pieces in total, if you want all, you can take them for 200 yuan....
拼命三郎V5 Buy&Sell
About shared memory release
The shared memory created by CreateFileMapping MapViewOfFile is used to share data between two processes. If one of the two processes ends, do we need to release this shared memory? Or can we release ...
liu_liu520 Embedded System
EEWORLD University Hall----2016 TI Battery Management and Type C Seminar (Part 1)
2016 TI Battery Management and Type C Seminar (Part 1) : https://training.eeworld.com.cn/course/3726...
hi5 Power technology
Main circuit and analysis of question A
[i=s] This post was last edited by paulhyde on 2014-9-15 09:26 [/i] Give everyone some ideas, let's discuss it together...
yanglei1988 Electronics Design Contest
3D Printing in Progress
Mechanical structure diagram drawn with Solidworks, please clap your hands....
deweyled DIY/Open Source Hardware
What do the suffixes in component names mean?
For example, the datasheets of components BAS21 BAS21,235 BAS21,215 are all BAS21... What do 215,235 mean? Thank you!...
大发明家 PCB Design

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1531  2926  869  2763  1508  31  59  18  56  48 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号