LD031C331JAB9A datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> LD031C331JAB9A

LD031C331JAB9A: DescriptionCeramic Capacitor, Multilayer, Ceramic, 100V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.00033uF, Surface Mount, 0603, CHIP; CategoryPassive components capacitor; File Size99KB，7 Pages; ManufacturerAVX

Download Datasheet Parametric View All

LD031C331JAB9A Overview

Ceramic Capacitor, Multilayer, Ceramic, 100V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.00033uF, Surface Mount, 0603, CHIP

LD031C331JAB9A Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Objectid	1862905461
package instruction	, 0603
Reach Compliance Code	not_compliant
ECCN code	EAR99
capacitance	0.00033 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	0.9 mm
JESD-609 code	e0
length	1.6 mm
Manufacturer's serial number	LD03
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	5%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	BULK
positive tolerance	5%
Rated (DC) voltage (URdc)	100 V
series	LD
size code	0603
surface mount	YES
Temperature characteristic code	X7R
Temperature Coefficient	15% ppm/°C
Terminal surface	Tin/Lead (Sn/Pb)
Terminal shape	WRAPAROUND
width	0.81 mm

Preview

Download Datasheet

View All

MLCC Tin/Lead Termination “B”

General Specifications

AVX Corporation will support those customers for

commercial and military Multilayer Ceramic Capacitors with

a termination consisting of 5% minimum lead. This

termination is indicated by the use of a “B” in the 12th

position of the AVX Catalog Part Number. This fulfills AVX’s

commitment to providing a full range of products to our

customers. AVX has provided in the following pages a full

range of values that we are currently offering in this special

“B” termination. Please contact the factory if you require

additional information on our MLCC Tin/Lead Termination

“B” products.

PART NUMBER (see page 2 for complete part number explanation)

LD05

Size

LD02 - 0402

LD03 - 0603

LD04 - 0504*

LD05 - 0805

LD06 - 1206

LD10 - 1210

LD12 - 1812

LD13 - 1825

LD14 - 2225

LD20 - 2220

101

Capacitance

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Capacitance

Tolerance

Packaging

2 = 7" Reel

4 = 13" Reel

7 = Bulk Cass.

9 = Bulk

Special

Code

A = Std.

Product

Dielectric

Voltage

6.3V = 6 C0G (NP0) = A

X7R = C

10V = Z

X5R = D

16V = Y

X8R = F

25V = 3

35V = D

50V = 5

100V = 1

200V = 2

500V = 7

±.10 pF (<10pF)

±.25 pF (<10pF)

±.50 pF (<10pF)

±1% (≥ 10 pF)

±2% (≥ 10 pF)

±5%

±10%

±20%

Terminations

Failure

Rate

B = 5% min lead

A = Not X = FLEXITERM

Applicable

with 5% min

lead**

**X7R only

Contact

Factory

For

Multiples

*LD04 has the same CV ranges as LD03.

NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.

Contact factory for non-specified capacitance values.

See FLEXITERM

section

for CV options

NP0

X7R

X7S

X5R

Y5V

Refer to page 4 for Electrical Graphs

Refer to page 16 for Electrical Graphs

Refer to page 20 for Electrical Graphs

Refer to page 23 for Electrical Graphs

Refer to page 26 for Electrical Graphs

Recommended Resources

Schematic diagram of a distributed power supply system

Power outage emergency light circuit (4)

Circuit diagram to identify wind direction

465kHz IF signal generator circuit

HT-12F decoding circuit

Solution conductivity measurement circuit

Cyclone V Hard Memory Controller Compilation Issue: When designing hard memory controller logic using the Cyclone V 5CEFA7F31I7 chip, the compilation succeeds when the first hard memory controller (BANK 3B/4A) is used, but fails when the second hard me...; nc6836948 FPGA/CPLD

Who has the BroadLink DNA Kit?: I would like to ask, does anyone have the development tools for this theme, preferably a fully documented SDK development package? You can apply for it on the official website, but registration requir...; yvhxaypm stm32/stm8

IAR for MSP430 5.5 installation software and crack package: [size=4]Thanks to cxg2638 for sharing. The size of the package uploaded to the forum is limited. cxg2638 uploaded 15 packages. Thank you for your hard work! [/size] I combined the two posts of downloa...; wstt Microcontroller MCU

High Voltage Chip Capacitors: 高压贴片电容高压贴片电容又名陶瓷多层片式电容器，是一种用陶瓷粉生产技术，内部为贵金属钯金，用高温烧结法将银镀在陶瓷上作为电极制成。产品分为高频瓷介NPO(COG)和低频瓷介X7R两种材质。 NPO具有小的封装体积，高耐温度系数的电容，高频性能好，用于高稳定振荡回路中，作为电路滤波电容。X7R瓷介电容器限于在工作普通频率的回路中作旁路或隔直流用，或对稳定性和损耗要求不高的场合,这种电容器不...; a415998493 Automotive Electronics

DSP—Using Timer 0 Interrupt: [align=left][color=rgb(50, 62, 50)][font=simsun][b]Timer 0 interrupt setting[/b][color=#000000]Timer 0 interrupt setting consists of the following steps. [/color] [b]1) Basic conditions for timer 0 in...; 莫妮卡 DSP and ARM Processors

Step by step migration of Gizwits routines to Kylin Standard Edition V2.3: The MCU used in the Kirin Development Board is STM32F03RET6. It is equipped with a temperature and humidity sensor sht20, a three-axis acceleration sensor adxl345, an infrared tube tcrt5000, etc. Like...; dql2016 stm32/stm8

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components