LD035A470KAX9A datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> LD035A470KAX9A

LD035A470KAX9A: DescriptionCeramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.000047uF, Surface Mount, 0603, CHIP; CategoryPassive components capacitor; File Size110KB，7 Pages; ManufacturerAVX

Download Datasheet Parametric View All

LD035A470KAX9A Overview

Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.000047uF, Surface Mount, 0603, CHIP

LD035A470KAX9A Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	AVX
package instruction	, 0603
Reach Compliance Code	compli
ECCN code	EAR99
capacitance	0.000047 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
JESD-609 code	e0
Manufacturer's serial number	LD03
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	10%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
method of packing	BULK
positive tolerance	10%
Rated (DC) voltage (URdc)	50 V
size code	0603
surface mount	YES
Temperature characteristic code	C0G
Temperature Coefficient	-/+30ppm/Cel ppm/°C
Terminal surface	Tin/Lead (Sn/Pb)
Terminal shape	WRAPAROUND

Preview

Download Datasheet

View All

MLCC Tin/Lead Termination “B”

General Specifications

AVX Corporation will support those customers for

commercial and military Multilayer Ceramic Capacitors with

a termination consisting of 5% minimum lead. This

termination is indicated by the use of a “B” in the 12th

position of the AVX Catalog Part Number. This fulfills AVX’s

commitment to providing a full range of products to our

customers. AVX has provided in the following pages a full

range of values that we are currently offering in this special

“B” termination. Please contact the factory if you require

additional information on our MLCC Tin/Lead Termination

“B” products.

PART NUMBER (see page 2 for complete part number explanation)

LD05

Size

LD02 - 0402

LD03 - 0603

LD04 - 0504*

LD05 - 0805

LD06 - 1206

LD10 - 1210

LD12 - 1812

LD13 - 1825

LD14 - 2225

101

Capacitance

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Capacitance

Tolerance

Packaging

2 = 7" Reel

4 = 13" Reel

7 = Bulk Cass.

9 = Bulk

Special

Code

A = Std.

Product

Dielectric

Voltage

6.3V = 6 C0G (NP0) = A

X7R = C

10V = Z

X5R = D

16V = Y

X8R = F

25V = 3

50V = 5

100V = 1

200V = 2

500V = 7

±.10 pF (<10pF)

±.25 pF (<10pF)

±.50 pF (<10pF)

±1% (≥ 10 pF)

±2% (≥ 10 pF)

±5%

±10%

±20%

Terminations

Failure

Rate

B = 5% min lead

A = Not X = FLEXITERM™

Applicable

with 5% min

lead

Contact

Factory

For

Multiples

*LD04 has the same CV ranges as LD03.

NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.

Contact factory for non-specific capacitance values.

See FLEXITERM™ section

for CV options

NP0

X7R

X7S

X5R

Y5V

Refer to page 4 for Electrical Graphs

Refer to page 14 for Electrical Graphs

Refer to page 18 for Electrical Graphs

Refer to page 21 for Electrical Graphs

Refer to page 24 for Electrical Graphs

Recommended Resources

Feedback dielectric oscillator and equivalent circuit

Electronic keyboard circuit

New color TV power controller circuit (mc44608)

LA3600 power amplifier circuit

Combustible gas fully automatic igniter

Connection diagram when TX-KD201 drives dual forward or dual flyback circuits

Reasons for blocked vias in PCB manufacturing: Analysis of the reasons for the blocked vias in PCB board making: Mainly in the copper deposition and electroplating process, the hole wall is not properly treated, such as: glue residue, alkaline deg...; ESD技术咨询 PCB Design

[Mill MYB-YT507 development board trial experience] Python displays memory and CPU real-time status 1: [Mil MYB-YT507 development board trial experience] Install pyecharts module - Domestic chip exchange - Electronic Engineering World - Forum (eeworld.com.cn) The previous article introduced the install...; lugl4313820 Domestic Chip Exchange

Embedded linux DDR stress test, SPI flash read and write test help: I'm looking for a solution or source code. I transplanted memtester myself but it shows syntax errors. . . Please transplant it or give me some guidance....; 傻XX小魔法师 Linux and Android

Problems after successful driver uninstallation: The application layer code is as follows: mian() { HANDLE HAHA; HAHA = CreateEvent(NULL, FALSE, NULL, L"bb_write"); SetEvent(HAHA); } Driver layer: NTSTATUS DriverEntry( IN PDRIVER_OBJECT KeyDriverObj...; guiqixin100 Embedded System

How do RF circuits and digital circuits coexist harmoniously?: Monolithic RF devices greatly facilitate the application of wireless communication within a certain range. A complete wireless communication link can be formed by using a suitable microcontroller and ...; fish001 RF/Wirelessly

【TI Technical Article】: TI's new TMS320C66x fixed-point and floating-point DSP cores successfully challenge the speed limit: Texas Instruments' (TI) new TMS320C66x digital signal processor (DSP) cores not only bring significant performance improvements to the award-winning C64x+instruction set architecture (ISA) , but also ...; 德仪DSP新天地 DSP and ARM Processors

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components