SV17AA332KAATR1 datasheet, PDF

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SV17AA332KAATR1: DescriptionCeramic Capacitor, Multilayer, Ceramic, 1000V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.0033uF, Through Hole Mount, 9325, RADIAL LEADED; CategoryPassive components capacitor; File Size2MB，95 Pages; ManufacturerAVX

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SV17AA332KAATR1 Overview

Ceramic Capacitor, Multilayer, Ceramic, 1000V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.0033uF, Through Hole Mount, 9325, RADIAL LEADED

SV17AA332KAATR1 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	AVX
package instruction	, 9325
Reach Compliance Code	_compli
ECCN code	EAR99
capacitance	0.0033 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	19.8 mm
JESD-609 code	e0
length	23.6 mm
Manufacturer's serial number	SV
Installation features	THROUGH HOLE MOUNT
multi-layer	Yes
negative tolerance	10%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	Radial
method of packing	TR
positive tolerance	10%
Rated (DC) voltage (URdc)	1000 V
series	SV
size code	9325
surface mount	NO
Temperature characteristic code	C0G
Temperature Coefficient	-/+30ppm/Cel ppm/°C
Terminal surface	Tin/Lead (Sn/Pb)
Terminal pitch	20.3 mm
Terminal shape	WIRE
width	6.35 mm

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A KYOCERA GROUP COMPANY

AVX

SMPS Caps/High Voltage Caps

Tip & Ring/Cap Arrays/Discoidals

Advanced Applications

Contents

Introduction – Application Specific MLCs

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3

SMPS Capacitors

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7

SM Style Stacked MLC Capacitors (US Preferred Sizes) . . . . . . . . . . . . . . . . . . . . . . . . . 8-28

CH/CV Style (European Preferred Sizes) Vertical/Horizontal Mount . . . . . . . . . . . . . . . . 29-34

RH Style (European Preferred Sizes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35-36

Assembly Guidelines (SM, CH, CV & RH Styles) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37-38

SK Style . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39-40

SE Style . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41-42

CECC Offering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

High Voltage MLC Leaded

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

ESA Qualified SMPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44-49

HV Style (US Preferred Sizes) DIP Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50-52

CH/CV Style (European Preferred Sizes)

Vertical/Horizontal Mount, DIP & Radial Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53-56

SV Style Radial Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57-59

MLC Chip Capacitors

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

Basic Construction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61-64

Surface Mounting Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65-68

High Voltage MLC Chips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69-70

Hi-Q

High RF Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71-75

Tip & Ring Chips. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76-77

MLC Chips, Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

Single-In-Line Packages (SIP)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79-80

Discoidal MLC Feed-Through Capacitors and Filters

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

DC Style (US Preferred Sizes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82-84

XB Style (European Preferred Sizes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85-88

XF Style (Feed-Through Discoidal). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85-88

Filtered Arrays XD Type

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

CECC Ceramic Chips

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

Baseline Management – BS9100 Requirements

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

Advanced Application Specific Products

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

AVX Internet/FAX/CD Rom/Software

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

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