Bus Driver, P Series, 4-Func, 8-Bit, True Output, CMOS
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| package instruction | , |
| Reach Compliance Code | compli |
| series | P |
| JESD-30 code | R-XZMA-T75 |
| JESD-609 code | e0 |
| Logic integrated circuit type | BUS DRIVER |
| Number of digits | 8 |
| Number of functions | 4 |
| Number of ports | 2 |
| Number of terminals | 75 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| propagation delay (tpd) | 4.8 ns |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal location | ZIG-ZAG |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| IDT7MP9244AT | IDT7MP9244CT | IDT7MP9245CT | IDT7MP9245T | IDT7MP9244T | IDT7MP9245AT | |
|---|---|---|---|---|---|---|
| Description | Bus Driver, P Series, 4-Func, 8-Bit, True Output, CMOS | Bus Transceiver, P Series, 4-Func, 8-Bit, True Output, CMOS | Bus Transceiver, P Series, 2-Func, 18-Bit, True Output, CMOS | Bus Driver, P Series, 2-Func, 18-Bit, True Output, CMOS | Bus Driver, P Series, 4-Func, 8-Bit, True Output, CMOS | Bus Driver, P Series, 2-Func, 18-Bit, True Output, CMOS |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Reach Compliance Code | compli | compliant | compliant | compliant | compliant | compliant |
| series | P | P | P | P | P | P |
| JESD-30 code | R-XZMA-T75 | R-XZMA-T75 | R-XZMA-T75 | R-XZMA-T75 | R-XZMA-T75 | R-XZMA-T75 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | BUS DRIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| Number of digits | 8 | 8 | 18 | 18 | 8 | 18 |
| Number of functions | 4 | 4 | 2 | 2 | 4 | 2 |
| Number of ports | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 75 | 75 | 75 | 75 | 75 | 75 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| propagation delay (tpd) | 4.8 ns | 4.1 ns | 4.1 ns | 7 ns | 6.5 ns | 4.6 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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