Z86C0612SEC datasheet, PDF - EEWORLD Datasheet

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Z86C0612SEC: DescriptionMicrocontroller, 8-Bit, MROM, Z8 CPU, 12MHz, CMOS, PDSO18, PLASTIC, SOIC-18; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，54 Pages; ManufacturerIXYS

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Z86C0612SEC Overview

Microcontroller, 8-Bit, MROM, Z8 CPU, 12MHz, CMOS, PDSO18, PLASTIC, SOIC-18

Z86C0612SEC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IXYS
Parts packaging code	SOIC
package instruction	PLASTIC, SOIC-18
Contacts	18
Reach Compliance Code	unknow
Has ADC	NO
Other features	OPTIONAL LOW EMI MODE; ROM PROTECT; TWO STANDBY MODES
Address bus width
bit size	8
boundary scan	NO
CPU series	Z8
maximum clock frequency	12 MHz
DAC channel	NO
DMA channel	NO
External data bus width
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	R-PDSO-G18
JESD-609 code	e0
length	11.55 mm
low power mode	YES
Number of DMA channels
Number of external interrupt devices	6
Number of I/O lines	14
Number of serial I/Os	1
Number of terminals	18
Number of timers	2
On-chip data RAM width	8
On-chip program ROM width	8
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP18,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	225
power supply	3.3/5 V
Certification status	Not Qualified
RAM (bytes)	124
RAM (number of words)	124
rom(word)	1024
ROM programmability	MROM
Maximum seat height	2.65 mm
speed	12 MHz
Maximum slew rate	15 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	3 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	7.5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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Z86C0612SEC Related Products

	Z86C0612SEC	Z86C0612SEG	Z86C0308PSG	Z86C0308PSC	Z86C0308SSC	Z86C0308SSG
Description	Microcontroller, 8-Bit, MROM, Z8 CPU, 12MHz, CMOS, PDSO18, PLASTIC, SOIC-18	Microcontroller, 8-Bit, MROM, 12MHz, CMOS, PDSO18, PLASTIC, SOIC-18	Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDIP18, PLASTIC, DIP-18	Microcontroller, 8-Bit, MROM, Z8 CPU, 8MHz, CMOS, PDIP18, PLASTIC, DIP-18	Microcontroller, 8-Bit, MROM, Z8 CPU, 8MHz, CMOS, PDSO18, PLASTIC, SOIC-18	Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDSO18, PLASTIC, SOIC-18
Is it lead-free?	Contains lead	Lead free	Lead free	Contains lead	Contains lead	Lead free
Maker	IXYS	IXYS	IXYS	IXYS	IXYS	IXYS
Parts packaging code	SOIC	SOIC	DIP	DIP	SOIC	SOIC
package instruction	PLASTIC, SOIC-18	PLASTIC, SOIC-18	PLASTIC, DIP-18	PLASTIC, DIP-18	PLASTIC, SOIC-18	PLASTIC, SOIC-18
Contacts	18	18	18	18	18	18
Reach Compliance Code	unknow	compliant	compliant	unknow	unknow	compliant
Has ADC	NO	NO	NO	NO	NO	NO
Other features	OPTIONAL LOW EMI MODE; ROM PROTECT; TWO STANDBY MODES	OPTIONAL LOW EMI MODE; ROM PROTECT; TWO STANDBY MODES	OPTIONAL LOW EMI MODE; ROM PROTECT; TWO STANDBY MODES	OPTIONAL LOW EMI MODE; ROM PROTECT; TWO STANDBY MODES	OPTIONAL LOW EMI MODE; ROM PROTECT; TWO STANDBY MODES	OPTIONAL LOW EMI MODE; ROM PROTECT; TWO STANDBY MODES
bit size	8	8	8	8	8	8
boundary scan	NO	NO	NO	NO	NO	NO
maximum clock frequency	12 MHz	12 MHz	8 MHz	8 MHz	8 MHz	8 MHz
DAC channel	NO	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO	NO
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	NO	NO	NO	NO	NO	NO
JESD-30 code	R-PDSO-G18	R-PDSO-G18	R-PDIP-T18	R-PDIP-T18	R-PDSO-G18	R-PDSO-G18
JESD-609 code	e0	e3	e3	e0	e0	e3
length	11.55 mm	11.55 mm	22.86 mm	22.86 mm	11.575 mm	11.575 mm
low power mode	YES	YES	YES	YES	YES	YES
Number of external interrupt devices	6	6	6	6	6	6
Number of I/O lines	14	14	14	14	14	14
Number of terminals	18	18	18	18	18	18
Number of timers	2	2	1	1	1	1
On-chip data RAM width	8	8	8	8	8	8
On-chip program ROM width	8	8	8	8	8	8
Maximum operating temperature	105 °C	105 °C	70 °C	70 °C	70 °C	70 °C
PWM channel	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	DIP	DIP	SOP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	225	225	225	NOT SPECIFIED	225	225
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (number of words)	124	124	60	60	60	60
rom(word)	1024	1024	512	512	512	512
ROM programmability	MROM	MROM	MROM	MROM	MROM	MROM
Maximum seat height	2.65 mm	2.65 mm	4.24 mm	4.24 mm	2.65 mm	2.65 mm
speed	12 MHz	12 MHz	8 MHz	8 MHz	8 MHz	8 MHz
Maximum slew rate	15 mA	15 mA	11 mA	11 mA	11 mA	11 mA
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	TIN	TIN	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	TIN
Terminal form	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	NOT SPECIFIED	30	30
width	7.5 mm	7.5 mm	7.62 mm	7.62 mm	7.5 mm	7.5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER

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