
Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | IXYS |
| Parts packaging code | SOIC |
| package instruction | SOIC-28 |
| Contacts | 28 |
| Reach Compliance Code | compli |
| Has ADC | NO |
| Address bus width | 8 |
| bit size | 8 |
| CPU series | Z8 |
| maximum clock frequency | 16 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | |
| JESD-30 code | R-PDSO-G28 |
| JESD-609 code | e3 |
| length | 17.9 mm |
| Number of I/O lines | 24 |
| Number of terminals | 28 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP28,.4 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 3.5/5.5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 125 |
| rom(word) | 2048 |
| ROM programmability | OTPROM |
| Maximum seat height | 2.64 mm |
| speed | 16 MHz |
| Maximum slew rate | 25 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 3.5 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 7.5 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |

| Z86E3116SSG | Z86E3016SEC | Z86E3016PSC | Z86E3016SSC | Z86E3016VSG | Z86E3116SEC | Z86E3116SSC | Z86E3016VEG | |
|---|---|---|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28 | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28 | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDIP28, PLASTIC, DIP-28 | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28 | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PQCC28, PLASTIC, LCC-28 | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28 | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28 | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PQCC28, PLASTIC, LCC-28 |
| Is it lead-free? | Lead free | Contains lead | Contains lead | Contains lead | Lead free | Contains lead | Contains lead | Lead free |
| Is it Rohs certified? | conform to | incompatible | incompatible | incompatible | conform to | incompatible | incompatible | conform to |
| Maker | IXYS | IXYS | IXYS | IXYS | IXYS | IXYS | IXYS | IXYS |
| Parts packaging code | SOIC | SOIC | DIP | SOIC | QLCC | SOIC | SOIC | QLCC |
| package instruction | SOIC-28 | SOIC-28 | PLASTIC, DIP-28 | SOIC-28 | PLASTIC, LCC-28 | SOIC-28 | SOIC-28 | PLASTIC, LCC-28 |
| Contacts | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compli | unknown | unknow | unknow | compli | unknow | unknow | compliant |
| Has ADC | NO | NO | NO | NO | NO | NO | NO | NO |
| Address bus width | 8 | 8 | 8 | 8 | 12 | 12 | 8 | 12 |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU series | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 |
| maximum clock frequency | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| DAC channel | NO | NO | NO | NO | NO | NO | NO | NO |
| DMA channel | NO | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 code | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 | S-PQCC-J28 | R-PDSO-G28 | R-PDSO-G28 | S-PQCC-J28 |
| JESD-609 code | e3 | e0 | e0 | e0 | e3 | e0 | e0 | e3 |
| length | 17.9 mm | 17.9 mm | 36.96 mm | 17.9 mm | 11.505 mm | 17.9 mm | 17.9 mm | 11.505 mm |
| Number of I/O lines | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Maximum operating temperature | 70 °C | 105 °C | 70 °C | 70 °C | 70 °C | 105 °C | 70 °C | 105 °C |
| PWM channel | NO | NO | NO | NO | NO | NO | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | DIP | SOP | QCCJ | SOP | SOP | QCCJ |
| Encapsulate equivalent code | SOP28,.4 | SOP28,.4 | DIP28,.6 | SOP28,.4 | LDCC28,.5SQ | SOP28,.4 | SOP28,.4 | LDCC28,.5SQ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 225 | 225 | NOT SPECIFIED | 240 | 260 | 225 | 225 | 225 |
| power supply | 3.5/5.5 V | 5 V | 3.5/5.5 V | 3.5/5.5 V | 3.5/5.5 V | 5 V | 3.5/5.5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 125 | 237 | 237 | 237 | 237 | 124 | 125 | 237 |
| rom(word) | 2048 | 4096 | 4096 | 4096 | 4096 | 2048 | 2048 | 4096 |
| ROM programmability | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM |
| Maximum seat height | 2.64 mm | 2.64 mm | 4.96 mm | 2.64 mm | 4.57 mm | 2.64 mm | 2.64 mm | 4.57 mm |
| speed | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| Maximum slew rate | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 3.5 V | 4.5 V | 3.5 V | 3.5 V | 3.5 V | 4.5 V | 3.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | TIN | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | MATTE TIN | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN |
| Terminal form | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | J BEND | GULL WING | GULL WING | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD |
| Maximum time at peak reflow temperature | 30 | 30 | NOT SPECIFIED | 20 | 40 | 30 | 30 | 30 |
| width | 7.5 mm | 7.5 mm | 15.24 mm | 7.5 mm | 11.505 mm | 7.5 mm | 7.5 mm | 11.505 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |