Quad, Closed-Loop Monolithic Buffer
| Parameter Name | Attribute value |
| Maker | National Semiconductor(TI ) |
| Parts packaging code | WAFER |
| package instruction | DIE, |
| Contacts | 11 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Amplifier type | BUFFER |
| Maximum average bias current (IIB) | 20 µA |
| Nominal bandwidth (3dB) | 700 MHz |
| JESD-30 code | R-XUUC-N11 |
| Negative supply voltage upper limit | -7 V |
| Nominal Negative Supply Voltage (Vsup) | -5 V |
| Number of functions | 1 |
| Number of terminals | 11 |
| Minimum output current | 0.048 A |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | RECTANGULAR |
| Package form | UNCASED CHIP |
| Certification status | Not Qualified |
| Nominal slew rate | 2700 V/us |
| Supply voltage upper limit | 7 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| CLC115MDC | CLC115 | CLC115AI | CLC115AJE | CLC115AJP | CLC115ALC | CLC115AMC | |
|---|---|---|---|---|---|---|---|
| Description | Quad, Closed-Loop Monolithic Buffer | Quad, Closed-Loop Monolithic Buffer | Quad, Closed-Loop Monolithic Buffer | Quad, Closed-Loop Monolithic Buffer | Quad, Closed-Loop Monolithic Buffer | Quad, Closed-Loop Monolithic Buffer | Quad, Closed-Loop Monolithic Buffer |
| Parts packaging code | WAFER | - | - | SOIC | DIP | WAFER | WAFER |
| package instruction | DIE, | - | - | SOP, SOP14,.25 | DIP, DIP14,.3 | DIE, DIE OR CHIP | DIE, DIE OR CHIP |
| Contacts | 11 | - | - | 14 | 14 | 11 | - |
| Reach Compliance Code | unknow | - | - | unknow | unknow | unknow | unknow |
| ECCN code | EAR99 | - | - | EAR99 | EAR99 | EAR99 | EAR99 |
| Amplifier type | BUFFER | - | - | BUFFER | BUFFER | BUFFER | BUFFER |
| Maximum average bias current (IIB) | 20 µA | - | - | 20 µA | 20 µA | 20 µA | 20 µA |
| Nominal bandwidth (3dB) | 700 MHz | - | - | 700 MHz | 270 MHz | 700 MHz | 700 MHz |
| JESD-30 code | R-XUUC-N11 | - | - | R-PDSO-G14 | R-PDIP-T14 | X-XUUC-N10 | X-XUUC-N10 |
| Negative supply voltage upper limit | -7 V | - | - | -7 V | -7 V | -7 V | -7 V |
| Nominal Negative Supply Voltage (Vsup) | -5 V | - | - | -5 V | -5 V | -5 V | -5 V |
| Number of functions | 1 | - | - | 4 | 4 | 4 | 4 |
| Number of terminals | 11 | - | - | 14 | 14 | 10 | 10 |
| Package body material | UNSPECIFIED | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | DIE | - | - | SOP | DIP | DIE | DIE |
| Package shape | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | UNSPECIFIED | UNSPECIFIED |
| Package form | UNCASED CHIP | - | - | SMALL OUTLINE | IN-LINE | UNCASED CHIP | UNCASED CHIP |
| Certification status | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal slew rate | 2700 V/us | - | - | 2700 V/us | 2700 V/us | 2700 V/us | 2700 V/us |
| Supply voltage upper limit | 7 V | - | - | 7 V | 7 V | 7 V | 7 V |
| Nominal supply voltage (Vsup) | 5 V | - | - | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | - | - | YES | NO | YES | YES |
| Terminal form | NO LEAD | - | - | GULL WING | THROUGH-HOLE | NO LEAD | NO LEAD |
| Terminal location | UPPER | - | - | DUAL | DUAL | UPPER | UPPER |
| Maximum bias current (IIB) at 25C | - | - | - | 20 µA | 20 µA | 20 µA | 20 µA |
| Maximum input offset voltage | - | - | - | 17000 µV | 9000 µV | 17000 µV | 17000 µV |
| Maximum operating temperature | - | - | - | 85 °C | 85 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | - | - | -40 °C | -40 °C | -55 °C | -55 °C |
| Encapsulate equivalent code | - | - | - | SOP14,.25 | DIP14,.3 | DIE OR CHIP | DIE OR CHIP |
| power supply | - | - | - | +-5 V | +-5 V | +-5 V | +-5 V |
| minimum slew rate | - | - | - | 2200 V/us | 2200 V/us | 2200 V/us | 2200 V/us |
| Maximum slew rate | - | - | - | 61 mA | 61 mA | 61 mA | 61 mA |
| technology | - | - | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | - | - | - | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
| Base Number Matches | - | - | - | 1 | 1 | 1 | 1 |