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CM4532R33ML

Description
WOUND CHIP INDUCTOR
File Size567KB,8 Pages
ManufacturerABC [ABC Taiwan Electronics Corp]
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CM4532R33ML Overview

WOUND CHIP INDUCTOR

SPECIFICATION FOR APPROVAL
20070813-E
REF : 20070124-C
PROD.
NAME
PAGE: 1
ABC'S DWG NO.
ABC'S ITEM NO.
CM4532□□□□L□-□□□
WOUND CHIP INDUCTOR
Ⅰ﹒CONFIGURATION
& DIMENSIONS:
330K
Marking
Inductance code
A
B
C
E
F
:
:
:
:
:
4.5±0.3
3.2±0.2
3.2±0.2
1.2
1.0+0.3
-0
m/m
m/m
m/m
m/m
m/m
4.2±0.2
C
F
A
F
E
B
1.5
2.2
1.5
PCB Pattern
Ⅱ﹒SCHEMATIC
DIAGRAM:
d
Ⅲ﹒MATERIALS:
a﹒Core:Ferrite DR core
b﹒Wire
:Enamelled
copper wire (class H)
c﹒Terminal:Cu/Sn
d﹒Encapsulate:Epoxy novolac molding compound
e﹒Remark:Products comply with RoHS' requirements
Reflow profile
Peak Temp:250℃ max.
Max time above 245℃
:20~40sec
max.
Max time above 217℃
:60~150sec
max.
200℃~250℃ Average Ramp-up Rate:3℃/second max.
Temperature
Rising Area
Preheat Area
150 ~ 200
/ 60 ~ 180sec
Reflow Area
Forced Cooling Area
6
/ second max.
Peak Temperature
250
b
Ⅳ﹒GENERAL
SPECIFICATION:
a﹒Temp. rise
:20℃
max.
b﹒Ambient temp.:100℃ max.
c﹒Storage temp.:-40℃ ----+125℃
d﹒Operating temp.:-40℃----+125℃
Temperature (
)
250
245
217
200
150
100
50
20~40sec
e﹒Terminal pull strength:1.5 kg min.
f﹒Rated current:Current cause
inductance drop within 10%
g﹒Resistance to solder heat:260℃.10 secs.
h﹒Resistance to solvent:Per MIL-STD-202F
AR-001A
60~150sec
0
50
100
150
Time ( seconds )
1.6
a
c
200
250

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