TC9318FB datasheet, PDF - EEWORLD Datasheet

TC9318FB: DescriptionSINGLE CHIP DTS MICROCONTROLLER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，60 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TC9318FB Overview

SINGLE CHIP DTS MICROCONTROLLER

Parameter Name	Attribute value
Maker	Toshiba Semiconductor
Parts packaging code	QFP
package instruction	12 X 12 MM, 0.65 MM PITCH, PLASTIC, QFP-64
Contacts	64
Reach Compliance Code	unknow
Has ADC	YES
Address bus width
bit size	4
maximum clock frequency	0.075 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-PQFP-G64
JESD-609 code	e0
length	12 mm
Number of I/O lines	10
Number of terminals	64
Maximum operating temperature	60 °C
Minimum operating temperature	-10 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP64,.5SQ
Package shape	SQUARE
Package form	FLATPACK
power supply	3 V
Certification status	Not Qualified
RAM (bytes)	128
rom(word)	16384
ROM programmability	MROM
Maximum seat height	1.85 mm
Maximum slew rate	12 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	1.8 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
width	12 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

	TC9318FB	TC9318FA
Description	SINGLE CHIP DTS MICROCONTROLLER	SINGLE CHIP DTS MICROCONTROLLER
Parts packaging code	QFP	QFP
package instruction	12 X 12 MM, 0.65 MM PITCH, PLASTIC, QFP-64	10 X 10 MM, 0.50 MM PITCH, PLASTIC, LQFP-64
Contacts	64	64
Reach Compliance Code	unknow	unknow
Has ADC	YES	YES
bit size	4	4
maximum clock frequency	0.075 MHz	0.075 MHz
DAC channel	NO	NO
DMA channel	NO	NO
JESD-30 code	S-PQFP-G64	S-PQFP-G64
JESD-609 code	e0	e0
length	12 mm	10 mm
Number of I/O lines	10	10
Number of terminals	64	64
Maximum operating temperature	60 °C	60 °C
Minimum operating temperature	-10 °C	-10 °C
PWM channel	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	FQFP
Encapsulate equivalent code	QFP64,.5SQ	QFP64,.47SQ,20
Package shape	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK, FINE PITCH
power supply	3 V	3 V
Certification status	Not Qualified	Not Qualified
RAM (bytes)	128	128
rom(word)	16384	16384
ROM programmability	MROM	MROM
Maximum seat height	1.85 mm	1.85 mm
Maximum slew rate	12 mA	12 mA
Maximum supply voltage	3.6 V	3.6 V
Minimum supply voltage	1.8 V	1.8 V
Nominal supply voltage	3 V	3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD
Terminal form	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.5 mm
Terminal location	QUAD	QUAD
width	12 mm	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER
Base Number Matches	1	1

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