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FT7C170-20DM

Description
Standard SRAM, 4KX4, 20ns, CMOS, CDIP20, 0.300 INCH, CERAMIC, DIP-20
Categorystorage    storage   
File Size727KB,15 Pages
ManufacturerForce Technologies Ltd.
Download Datasheet Parametric View All

FT7C170-20DM Overview

Standard SRAM, 4KX4, 20ns, CMOS, CDIP20, 0.300 INCH, CERAMIC, DIP-20

FT7C170-20DM Parametric

Parameter NameAttribute value
MakerForce Technologies Ltd.
Parts packaging codeDIP
package instructionDIP,
Contacts20
Reach Compliance Codeunknow
ECCN code3A001.A.2.C
Maximum access time20 ns
JESD-30 codeR-CDIP-T20
memory density16384 bi
Memory IC TypeSTANDARD SRAM
memory width4
Number of functions1
Number of terminals20
word count4096 words
character code4000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize4KX4
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
FT7C168, FT7C169, FT7C170
HIGH SPEED 4K x 4
SRAM
FEATURES
Full CMOS, 6T Cell
High Speed (Equal Access and Cycle Times)
– 12/15/20/25/35ns (Commercial)
– 20/25/35/45/55/70ns (FT7C168 Military)
Low Power Operation (Commercial)
– 715 mW Active
– 193 mW Standby (TTL Input)
FT7C168
– 83 mW Standby (CMOS Input)
FT7C168
Single 5V±10% Power Supply
Fully TTL Compatible, Common I/O Ports
Three Options
FT7C168
Low Power Standby Mode
FT7C169
Fast Chip Select Control
FT7C170
Fast Chip Select, Output Enable
Controls
Standard Pinout (JEDEC Approved)
FT7C168:
20-pin DIP, SOJ, LCC, SOIC,
CERPACK, and Flat Pack
FT7C169:
20-pin DIP and SOIC
FT7C170:
22-pin DIP
DESCRIPTION
The
FT7C168, FT7C169
and
FT7C170
are a family of
16,384-bit ultra high-speed static RAMs organized as 4K
x 4. All three devices have common input/output ports.The
FT7C168
enters the standby mode when the chip enable
(CE) control goes HIGH; with CMOS input levels, power
consumption is only 83mW in this mode. Both the
FT7C169
and the
FT7C170
offer a fast chip select access time that
is only 67% of the address access time. In addition, the
FT7C170
includes an output enable (OE) control to elimi-
nate data bus contention. The RAMs operate from a
single 5V ± 10% tolerance power supply.
Access times as fast as 12 nanoseconds are available,
permitting greatly enhanced system operating speeds.
CMOS is used to reduce power consumption to a low 715
mW active, 193 mW standby.
The
FT7C168
and
FT7C169
are available in 20-pin (FT7C170
in 22-pin) 300 mil DIP packages providing excellent
board level densities. The
FT7C168
is also available in 20-
pin 300 mil SOIC, SOJ, CERPACK, and Flat Pack
packages.
The
FT7C169
is also available in a 20-pin 300 mil SOIC
package.
FUNCTIONAL BLOCK DIAGRAM
PIN CONFIGURATIONS
Only FT7C168
FT7C168
FT7C169
DIP (P2, C6, D2)
DIP (P2)
SOIC (S2)
SOIC (S2)
SOJ (J2)
CERPACK (F2)
SOLDER SEAL FLAT PACK (FS-2)
FT7C170
DIP (P3)d
CE Used On FT7C168 Also For Power Down Functions
CE Used On FT7C169 Fast Chip Select
OE Output Enable Function On FT7C170
1
Revised October 2006
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