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TSPC860MHVG40B

Description
Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size4MB,95 Pages
Manufacturere2v technologies
Download Datasheet Parametric View All

TSPC860MHVG40B Overview

Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357

TSPC860MHVG40B Parametric

Parameter NameAttribute value
Makere2v technologies
Parts packaging codeBGA
package instructionCERAMIC, BGA-357
Contacts357
Reach Compliance Codeunknow
ECCN code3A991.A.2
Address bus width32
bit size32
boundary scanYES
maximum clock frequency40 MHz
External data bus width32
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-CBGA-B357
low power modeNO
Number of terminals357
Maximum operating temperature110 °C
Minimum operating temperature-40 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
speed40 MHz
Maximum supply voltage3.465 V
Minimum supply voltage3.135 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal locationBOTTOM
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR
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