BA6566FP datasheet, PDF - EEWORLD Datasheet

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BA6566FP: DescriptionSpeech network; CategoryWireless rf/communication Telecom circuit; File Size149KB，9 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/; Environmental Compliance

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BA6566FP Overview

Speech network

BA6566FP Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	ROHM Semiconductor
Parts packaging code	SOIC
package instruction	HSOP-24
Contacts	24
Reach Compliance Code	compli
JESD-30 code	R-PDSO-G26
JESD-609 code	e3/e2
length	13.6 mm
Number of functions	1
Number of terminals	26
Maximum operating temperature	60 °C
Minimum operating temperature	-35 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HSSOP
Encapsulate equivalent code	SOP32,.3,32
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
power supply	2/7 V
Certification status	Not Qualified
Maximum seat height	2.11 mm
Maximum slew rate	0.125 mA
surface mount	YES
technology	BIPOLAR
Telecom integrated circuit types	TELEPHONE SPEECH CIRCUIT
Temperature level	OTHER
Terminal surface	TIN/TIN COPPER
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	10
width	5.4 mm

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Communication ICs

Speech network

BA6566 / BA6566F / BA6566FP

The BA6566, BA6566F, and BA6566FP are speech network ICs which possess the basic functions required for handset

communications. In addition to amplifying signals from a transmitter and sending them to a telephone line, they amplify

only reception signals from a telephone line and drive the receiver. They also compensate for fluctuation in the volume

at which signals are transmitted and received, caused by the length of the telephone line (AGC).

FApplications

Telephones and telephone equipment

FFeatures

1) Can accommodate both dynamic and piezoelectric

receivers, simply by changing the circuit constant for

a wide dynamic reception range.

2) Automatic gain control (AGC) is used, based on the

transmission and reception telephone line current,

for easier compliance with communications stan-

dards.

FBlock

diagram

3) Erroneous operation caused by high-frequency elec-

trical wave interference is minimized.

4) An HSOP package is used, eliminating the need for

an attached transistor to dissipate heat. This means

that a common circuit can be shared when a DIP

package is used (BA6566FP).

217

BA6566FP Related Products

	BA6566FP	BA6566	BA6566F
Description	Speech network	Speech network	Speech network
Is it lead-free?	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to
Maker	ROHM Semiconductor	ROHM Semiconductor	ROHM Semiconductor
Parts packaging code	SOIC	DIP	SOIC
package instruction	HSOP-24	DIP-18	SOP-18
Contacts	24	18	18
Reach Compliance Code	compli	compli	compli
JESD-30 code	R-PDSO-G26	R-PDIP-T18	R-PDSO-G18
JESD-609 code	e3/e2	e3/e2	e3/e2
length	13.6 mm	22.9 mm	11.2 mm
Number of functions	1	1	1
Number of terminals	26	18	18
Maximum operating temperature	60 °C	60 °C	60 °C
Minimum operating temperature	-35 °C	-35 °C	-35 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HSSOP	DIP	SOP
Encapsulate equivalent code	SOP32,.3,32	DIP18,.3	SOP18,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	IN-LINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260	260	260
power supply	2/7 V	2/7 V	2/7 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.11 mm	4.25 mm	1.9 mm
Maximum slew rate	0.125 mA	0.125 mA	0.125 mA
surface mount	YES	NO	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR
Telecom integrated circuit types	TELEPHONE SPEECH CIRCUIT	TELEPHONE SPEECH CIRCUIT	TELEPHONE SPEECH CIRCUIT
Temperature level	OTHER	OTHER	OTHER
Terminal surface	TIN/TIN COPPER	TIN/TIN COPPER	TIN/TIN COPPER
Terminal form	GULL WING	THROUGH-HOLE	GULL WING
Terminal pitch	0.8 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	10	10	10
width	5.4 mm	7.62 mm	5.4 mm

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