EEWORLDEEWORLDEEWORLD

Part Number

Search

SGA8543ZSR

Description
HIGH IP3, MEDIUM POWER DISCRETE SiGe TRANSISTOR
File Size184KB,5 Pages
ManufacturerRF Micro Devices (Qorvo)
Download Datasheet Compare View All

SGA8543ZSR Overview

HIGH IP3, MEDIUM POWER DISCRETE SiGe TRANSISTOR

SGA8543Z
High IP
3
,
Medium Power
Discrete SiGe
Transistor
SGA8543Z
HIGH IP
3
, MEDIUM POWER DISCRETE SiGe
TRANSISTOR
Product Description
RFMD’s SGA8543Z is a high performance Silicon Germanium Heterostructure Bipo-
lar Transistor (SiGe HBT) designed for operation from 50MHzto3.5GHz. The
SGA8543Z is optimized for 3.3V operation but can be biased at 2.7V for low-volt-
age battery operated systems. The device provides low NF and excellent linearity at
a low cost. It can be operated over a wide range of currents depending on the
power and linearity requirements.The matte tin finish on the lead-free “Z” package
is applied using a post annealing process to mitigate tin whisker formation and is
RoHS compliant per EU Directive 2002/95. The package body is manufactured
with green molding
compounds that contain no antimony triox-
Optimum Technology
ide or halogenated fire retardants.
Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT
SiGe BiCMOS
G
MAX
(dB)
31.0
28.0
OIP
3
25.0
22.0
19.0
P
1 dB
16.0
13.0
10.0
0.9
1.1
1.3
1.5
1.7
1.9
2.1
2.3
2.5
23
20
17
G
M AX
32
29
26
Features
.05GHzto3.5GHz Operation
Lead Free, RoHS Compliant, and
Green Package
1.5dB NF
MN
at 2.44GHz
15.6dB G
MAX
at 2.44GHz
P
1dB
=+20.6dBm at 2.44GHz
OIP
3
=+34.6dBm at 2.44GHz
Low Cost, High Performance,
Versatility
Typical G
MAX
, OIP
3
, P
1dB
@ 3.3V, 86mA
38
35
Applications
OIP
3
, P
1dB
(dBm)
Si BiCMOS
Analog and Digital Wireless
Systems
3G, Cellular, PCS, RFID
Fixed Wireless, Pager Systems
PA Stage for Medium Power
Applications
AN-079 Contains Detailed
Application Circuits
Condition
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MEMS
Frequency (GHz)
Parameter
Power Gain
Output Power at 1dB Compression
Output Third Order Intercept Point
Noise Figure
Minimum Noise Figure
Maximum Available Gain
[2]
Min.
Specification
Typ.
19.0
14.0
20.0
20.6
33.4
34.6
3.1
2.4
1.0
1.5
22.9
15.0
18.0
Max.
Unit
dB
dB
dBm
dBm
dBm
dBm
dB
dB
dB
dB
dB
dB
dB
880MHz, Z
S
=Z
SOPT
, Z
L
=Z
LOPT
2440MHz
880MHz, Z
S
=Z
SOPT
, Z
L
=Z
LOPT
2440MHz
880MHz, Z
S
=Z
SOPT
, Z
L
=Z
LOPT
2440MHz
880MHz, Z
S
=Z
SOPT
, Z
L
=Z
LOPT
2440MHz
880MHz, I
CE
=25mA, Z
S
OPT
, Z
L
=Z
L
, NF
MIN
2440MHz
880MHz, Z
S
=Z
S
, Z
L
=Z
L
2440MHz
880MHz
[2]
Insertion Gain
[1]
120
180
300
D
CC
Current Gain
Breakdown Voltage
5.7
6.0
V
Collector - Emitter
Device Operating Voltage
3.8
V
Collector - Emitter
Device Operating Current
95
mA
Collector - Emitter
Thermal Resistance
151
°C/W
junction to backside
Test Conditions: V
CE
=3.3V, I
CE
=86mA Typ. (unless noted otherwise), T
L
=25°C, OIP
3
Tone Spacing=1MHz, P
OUT
per tone=5dBm
[1] 100% production tested using 50Ω contact board (no matching circuitry) [2] Data with Application Circuit
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
DS100809
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
1 of 5

SGA8543ZSR Related Products

SGA8543ZSR SGA8543Z-EVB1 SGA8543Z SGA8543Z-EVB2 SGA8543ZSQ
Description HIGH IP3, MEDIUM POWER DISCRETE SiGe TRANSISTOR HIGH IP3, MEDIUM POWER DISCRETE SiGe TRANSISTOR HIGH IP3, MEDIUM POWER DISCRETE SiGe TRANSISTOR HIGH IP3, MEDIUM POWER DISCRETE SiGe TRANSISTOR HIGH IP3, MEDIUM POWER DISCRETE SiGe TRANSISTOR
MSP430 MCU technical articles summary (457 articles in total)
[size=6][color=#ff0000]A total of 457 articles on MSP430 microcontroller application strength collected from the Internet. [/color][/size] [size=5][color=#0000ff]The information has been packaged and ...
tiankai001 Microcontroller MCU
TI CC3200 WIFI Training Development Kit——by light-s
@ light-s TI CC3200 WIFI Training Development Kit (OURS-SDK-WFB) IAR for ARM7.8 Debugging 1————Data Preparation TI CC3200 WIFI Training Development Kit (OURS-SDK-WFB Debug 2 - Familiarity with IAR for...
okhxyyo Special Edition for Assessment Centres
[Nucleo in-depth review] Part 1 X-CUBE-BLE1 V2.2+OSXSmartConnPS.zip
[i=s]This post was last edited by damiaa on 2014-12-24 22:18[/i] I downloaded two new packages, both of which seem to be from December 5th[/color][/size], which are newer than the original ones. The o...
damiaa stm32/stm8
Considerations of EMI issues in white LED driver design for mobile phones
At present, mobile phones generally use white light LED as the backlight element of the display screen. The corresponding white light LED driver has become an indispensable IC in mobile phone design. ...
LED Zone
AD09 Issues with converting PCB to PDF
When converting PCB to PDF in AD09, the printing direction cannot be selected using the built-in SMART PDF, and the pads are lost using PDF Factory pro. Could you please help me? Thank you!...
amy_shen PCB Design
Wince kernel image loading
How do I add images to the WINCE kernel?...
sxfzdw Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 486  698  2546  2596  1438  10  15  52  53  29 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号