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NGC-3725EW8200G

Description
Fixed Resistor, Metal Glaze/thick Film, 380W, 820ohm, 2% +/-Tol, 3825,
CategoryPassive components    The resistor   
File Size420KB,2 Pages
ManufacturerInternational Manufacturing Services Inc
Download Datasheet Parametric View All

NGC-3725EW8200G Overview

Fixed Resistor, Metal Glaze/thick Film, 380W, 820ohm, 2% +/-Tol, 3825,

NGC-3725EW8200G Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerInternational Manufacturing Services Inc
Reach Compliance Codecompli
ECCN codeEAR99
Other featuresTHE MAXIMUM THICKNESS AVAILABLE FOR SUBSTRATE G IS 0.889
structureChi
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.635 mm
Package length9.525 mm
Package formSMT
Package width6.35 mm
method of packingBULK; TR
Rated power dissipation(P)380 W
Rated temperature100 °C
resistance820 Ω
Resistor typeFIXED RESISTOR
size code3725
surface mountYES
technologyMETAL GLAZE/THICK FILM
Terminal shapeWRAPAROUND
Tolerance2%
0505
1005
0805
1206
N-
Series
2010
2525
2512
3725
Thick Film High Power Chip
Resistors and Terminations
on Aluminum Nitride
The
ims
N-Series thick film high power chip resistors and chip terminations on
aluminum nitride are ideal for most applications requiring high thermal conductivity in
a small size package. AlN is an ideal replacement for BeO with it’s high power
dissipation and no enviromental or health hazards. Thick film technology provides a
stable resistive element at a very affordable price. These chips feature the following:
• High stability thick film resistive element
• AlN substrate material
• Operating temperature: -55°C to +155°C
• Available in bulk or tape and reel*
*Consult factory
Terminal materials:
Terminal styles
epoxy or solder attachment
for bonding
solder attachment
Features
Very high power
dissipation
Thick film technology
AlN substrate material
Resistance values from
10 ohms to 2 Kohms†
Standard tolerance 5%
Tight TCRs
SG - Single wrap
with groundplane
WA-
Full wraparound
solder attachment
Rated Power
Thickness
Baseplate
Temp
0505
0805
CASE SIZE
1005
1206
2010
2512
2525
3725
N/A
N/A
0.015” “D”
50°C
30W
50W
60W
105W
150W
70°C
100°C
16W
50°C
70°C
16W
100°C
10W
16W
50°C
N/A
N/A
N/A
N/A
60W
70W
150W
0.040” “T”
70°C 100°C
N/A
N/A
N/A
N/A
48W
60W
N/A
N/A
N/A
N/A
30W
38W
75W
37W
48W
85W
150W
N/A
N/A
30W
55W
75W
100W
N/A
N/A
30W
40W
70W
90W
30W
55W
75W
100W
190W
380W
310W
35W
48W
60W
A Word About Thermal Management
temperature of the chip is maintained at or below the values identified in the above table
and the maximum film temperature did not exceed 150°C. The data also shows that the
ratio of temperature rise versus power applied increases with increasing chip size (for a
given thickness) so the above criteria should be carefully considered when operating
host of circuit dependent parameters.
International
Manufacturing
Services, Inc.
Tel (401) 683-9700
Fax (401) 683-5571
e-mail: ims@ims-resistors.com
http://www.ims-resistors.com

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