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CLB0GB5470K1000TC1

Description
Microwave Integrated Circuits
File Size156KB,2 Pages
ManufacturerMurata
Websitehttps://www.murata.com
Download Datasheet View All

CLB0GB5470K1000TC1 Overview

Microwave Integrated Circuits

Product Search Data Sheet
CLB0GB5470K1000TC1
Appearance & Shape
Features
1. Fine grained high-density ceramic dielectric, pure
gold electrode and simple single layer structure
provide very reliable performance and excellent
frequency characteristics.
2. A wide selection of sizes from very miniature
0.25mm square is suited to high-density mounting.
3. For compatibility with the gold electrodes, die
bonding with Au-Sn is possible and wire bonding
with gold wire is possible.
4. To improve handling of bonding, Au-Sn coating is
available on one side or both sides.
5. Custom made type (dimensions, cap. values, etc.)
are also available upon request.
Packaging Information
Packaging
TC
Specifications
Tray
Minimum
Order Quantity
100
Applications
1. Microwave Integrated Circuits
2. Microwave Devices
3. Optical Devices
4. Measuring Equipments
1 of 2
Atten ti o n
1.T his datasheet is downloaded from the website of Murata Manufacturing Co., Ltd. T herefore, it’s specifications are subject to change or our products in it may be discontinued
without advance notice. Please check with our sales representatives or product engineers before ordering.
2.T his datasheet has only typical specifications because there is no space for detailed specifications.
T herefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
URL : http://www.murata.com/
Last updated
2016/05/30
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