Surface Mount PIN Diode Limiter
LM102202-H-C-301 Series Datasheet
Features
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Surface Mount Limiter in Compact Outline:
8mm L x 5mm W x 2.5 mm H
Incorporates PIN Limiter & Schottky Diodes, D.C. Blocks & D.C. Return
Higher Average Power Handling than Plastic ( 50 W C.W. Power )
Lower Insertion Loss ( 0.8 dB ) & Lower Flat Leakage Power ( 17 dBm )
RoHS Compliant
Description
The LM102202-H-C-301 Surface Mount Silicon PIN Diode Limiters is manufactured using Aeroflex-Metelics
proven hybrid manufacturing process incorporating PIN Diodes and passive devices integrated within a
ceramic substrate. This low profile, compact, surface mount component, (8mm L x 5mm W x 2.5 mm H)
offers superior low and high signal performance to comparable MMIC devices in QFN packages. The Limiter
Modules are designed to optimize small signal insertion loss, (N.F.) and high signal flat leakage performance
in a compact, surface mount package.
Using PIN Diodes with lower thermal resistance (< 10 ºC/W), and a De-coupled Schottky detector network
as a current source, RF C.W. incident power levels of +47 dBm and RF peak incident power levels of
+53 dBm @ 20 μS RF pulse width, 1% duty cycle are very achievable. In addition, this design concept
provides lower flat leakage power (< + 17 dBm) and lower spike leakage energy (< 0.5 Ergs) for superior
LNA protection
Applications
This LM102202-H-C-301 Limiter is ideal for octave band Radar applications, requiring high volume, surface
mount, solder re-flow manufacturing. These products are durable, reliable, and capable of meeting all
military, commercial, and industrial environments. These devices are RoHS compliant and are available in
tube or tape-reel.
Environmental Capabilities
The LM102202-H-C-301 Limiter is capable of meeting the environmental requirements of MIL-STD-750 and
MIL-STD-202.
ESD and Moisture Sensitivity Level Rating
PIN Diode Limiters are susceptible to ESD conditions as with all semiconductors. The ESD rating for this
device is Class 0, HBM. The moisture sensitivity level rating for this device is MSL 1.
Thermal Grounding Caution
Product engineering dictates that the LM Family of high power limiters require proper heat sinking for high
power applications > 40 dBm (10W). Aeroflex /Metelics recommends using the Aeroflex / Metelics Part
Number PNMN13881 heat sink block which was developed for LM family.
Document No. DS 13301 Rev. A, ECN 10974
Revision Date: 11/8/2011
PIN Diode Limiter
LM102202-H-C-301 Electrical Specifications @ Zo = 50
Ω,
TA=+ 25 ºC
(Unless Otherwise Defined)
Parameter
Frequency
Insertion Loss
Return Loss
Input Compression Power
2nd Harmonic
Peak Incident Power
C.W. Incident Power
Flat Leakage Power
Symbol
F
IL
RL
P1dB
2Fo
Pinc(Pk)
Pinc(CW)
Pf
Units
GHz
dB
dB
dBm
dBc
dBm
dBm
dBm
Test Conditions
Swept Frequency
Swept Frequency
Po = 0 dBm
Swept Frequency
Po = 0 dBm
Swept Frequency
Po = 0 dBm
Fo = 1.0 GHz
RF Pulse Width =
20 μS, 1% duty
Swept Frequency
+53 dBm,
RF Pulse Width =
20 μS, 1% duty
Spike Leakage Energy
Es
Ergs
+53 dBm,
RF Pulse Width =
20 μS, 1% duty
Recovery Time
Τ
r
μS
( 50% Trailing RF ,
Pulse - 1 dB IL )
+53 dBm,
RF Pulse Width =
20μS, 1% duty
--
3
5
--
0.3
0.5
--
--
+47
+17
+48
+18
--
+53
+54
+7
45
+8
50
+10
--
| -15 |
| -16 |
--
Minimum
Value
0.8
--
Typical
Value
1.0 - 2.0
| -0.7 |
Maximum
Value
2.5
| -0.9 |
LM102202-H-C-301 Absolute Maximum Ratings
Parameter
Operating Temperature
Storage Temperature
Junction Temperature
RF C.W. Incident Power @ +85 ºC
Source & Load VSWR < 1.2:1
RF Peak. Incident Power @ +85 ºC
Source & Load VSWR < 1.2:1
Insertion Loss Rate of Change
with Operating Temperature
Assembly Temperature
Absolute Maximum Value
-65 ºC to +125 ºC
-65 ºC to +150 ºC
+175 ºC
+47 dBm
+53 dBm, RF Pulse Width = 20 μS, 1% duty cycle
| - 0.0025 dB / º C |
+260 ºC for 10 Seconds
2
603-641-3800 • 888-641--SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics
Document No. DS 13301 Rev. A, ECN 10974
Revision Date: 11/8/2011
PIN Diode Limiter
Assembly Instructions
The LM102202-H-C-301 Limiters are capable of being placed onto circuit boards with pick and place manufacturing
equipment from tube or tape-reel dispensing. The devices are attached to the circuit board using conventional solder
re-flow or wave soldering procedures with RoHS type or Sn 60 / Pb 40 type solders per Table I and Graph I Time-
Temperature recommended profile.
Table 1: Time-Temperature Profile for Sn 60 / Pb 40 or RoHS Type Solders
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Minimum (TSMIN)
- Temperature Maximum (TSMAX)
- Time (Minimum to maximum) (ts)
TSMAX to TL
- Ramp-up Rate
Time Maintained above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Time within 5°C of actual
Peak Temperature (TP)
Ramp-down Rate
Time 25°C to Peak Temperature
183°C
60-150 seconds
225
+0 / -5°C
Sn-Pb Eutectic
Assembly
3°C/second maximum
Pb-Free
Assembly
3°C/second maximum
100°C
150°C
60-120
seconds
150°C
200°C
60-180
seconds
3°C/second maximum
217°C
60-150 seconds
245
+0/-5°C
10-30 seconds
6°C/second maximum
6
minutes maximum
20-40 seconds
6°C/second maximum
8
minutes maximum
Graph1: Solder Re-Flow Time-Temperature Function
4
603-641-3800 • 888-641--SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics
Document No. DS 13301 Rev. A, ECN 10974
Revision Date: 11/8/2011
PIN Diode Limiter
LM102202-Q-B-301Outline Drawing, Case Style 301, (CS301)
ARX
DATE CODE
PART NUMBER
Notes:
1. The Hatched Metal Area on Circuit Side of Device is RF and D.C. Ground.
RF Circuit Solder Footprint for Case Style 301 (CS 301)
603-641-3800 • 888-641--SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics
Document No. DS 13301 Rev. A, ECN 10974
Revision Date: 11/8/2011
5
Analogue and Mixed Signal
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