TC55V2161FT datasheet, PDF - EEWORLD Datasheet

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TC55V2161FT: Description131,072 WORD BY 16 BIT STATIC RAM; File Size469KB，10 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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131,072 WORD BY 16 BIT STATIC RAM

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TC55V2161FT Related Products

	TC55V2161FT	TC55V2161FT-85L	TC55V2161FT-85	TC55V2161FT-10L	TC55V2161FT-10
Description	131,072 WORD BY 16 BIT STATIC RAM	131,072 WORD BY 16 BIT STATIC RAM	131,072 WORD BY 16 BIT STATIC RAM	131,072 WORD BY 16 BIT STATIC RAM	131,072 WORD BY 16 BIT STATIC RAM
Is it Rohs certified?	-	incompatible	incompatible	incompatible	-
Parts packaging code	-	TSOP2	TSOP2	TSOP2	TSOP2
package instruction	-	TSOP2,	0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44	0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44	TSOP2,
Contacts	-	44	44	44	44
Reach Compliance Code	-	unknow	unknow	unknow	unknow
Maximum access time	-	85 ns	85 ns	100 ns	100 ns
JESD-30 code	-	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44
JESD-609 code	-	e0	e0	e0	-
length	-	18.41 mm	18.41 mm	18.41 mm	18.41 mm
memory density	-	2097152 bi	2097152 bi	2097152 bi	2097152 bi
Memory IC Type	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	-	16	16	16	16
Number of functions	-	1	1	1	1
Number of terminals	-	44	44	44	44
word count	-	131072 words	131072 words	131072 words	131072 words
character code	-	128000	128000	128000	128000
Operating mode	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	-	70 °C	70 °C	70 °C	70 °C
organize	-	128KX16	128KX16	128KX16	128KX16
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	TSOP2	TSOP2	TSOP2	TSOP2
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	-	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	-	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	-	YES	YES	YES	YES
technology	-	CMOS	CMOS	CMOS	CMOS
Temperature level	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	-	Tin/Lead (Sn/Pb)	TIN LEAD	TIN LEAD	-
Terminal form	-	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	-	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
width	-	10.16 mm	10.16 mm	10.16 mm	10.16 mm

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