4,194,304 WORD BY 1-BIT/1,048,576 WORD BY 4 BIT CMOS STATIC RAM
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Toshiba Semiconductor |
| package instruction | TSOP, TSOP32,.46 |
| Reach Compliance Code | unknow |
| Maximum access time | 20 ns |
| Spare memory width | 1 |
| I/O type | CONFIGURABLE |
| JESD-30 code | R-PDSO-G32 |
| JESD-609 code | e0 |
| memory density | 4194304 bi |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Number of terminals | 32 |
| word count | 1048576 words |
| character code | 1000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1MX4 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP |
| Encapsulate equivalent code | TSOP32,.46 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.01 A |
| Minimum standby current | 3 V |
| Maximum slew rate | 0.13 mA |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| TC55V1403FT-20 | TC55V1403J-15 | TC55V1403J-20 | TC55V1403J | TC55V1403FT-15 | |
|---|---|---|---|---|---|
| Description | 4,194,304 WORD BY 1-BIT/1,048,576 WORD BY 4 BIT CMOS STATIC RAM | 4,194,304 WORD BY 1-BIT/1,048,576 WORD BY 4 BIT CMOS STATIC RAM | 4,194,304 WORD BY 1-BIT/1,048,576 WORD BY 4 BIT CMOS STATIC RAM | 4,194,304 WORD BY 1-BIT/1,048,576 WORD BY 4 BIT CMOS STATIC RAM | 4,194,304 WORD BY 1-BIT/1,048,576 WORD BY 4 BIT CMOS STATIC RAM |
| Is it Rohs certified? | incompatible | incompatible | incompatible | - | - |
| Maker | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | - | Toshiba Semiconductor |
| package instruction | TSOP, TSOP32,.46 | SOJ, SOJ32,.44 | SOJ, SOJ32,.44 | - | TSOP2, TSOP32,.46 |
| Reach Compliance Code | unknow | unknow | unknow | - | unknow |
| Maximum access time | 20 ns | 15 ns | 20 ns | - | 15 ns |
| Spare memory width | 1 | 1 | 1 | - | 1 |
| I/O type | CONFIGURABLE | CONFIGURABLE | CONFIGURABLE | - | CONFIGURABLE |
| JESD-30 code | R-PDSO-G32 | R-PDSO-J32 | R-PDSO-J32 | - | R-PDSO-G32 |
| JESD-609 code | e0 | e0 | e0 | - | - |
| memory density | 4194304 bi | 4194304 bi | 4194304 bi | - | 4194304 bi |
| Memory IC Type | STANDARD SRAM | CACHE SRAM | STANDARD SRAM | - | CACHE SRAM |
| memory width | 4 | 4 | 4 | - | 4 |
| Number of terminals | 32 | 32 | 32 | - | 32 |
| word count | 1048576 words | 1048576 words | 1048576 words | - | 1048576 words |
| character code | 1000000 | 1000000 | 1000000 | - | 1000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | - | 70 °C |
| organize | 1MX4 | 1MX4 | 1MX4 | - | 1MX4 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| encapsulated code | TSOP | SOJ | SOJ | - | TSOP2 |
| Encapsulate equivalent code | TSOP32,.46 | SOJ32,.44 | SOJ32,.44 | - | TSOP32,.46 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL |
| power supply | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| Maximum standby current | 0.01 A | 0.01 A | 0.01 A | - | 0.01 A |
| Minimum standby current | 3 V | 3 V | 3 V | - | 3 V |
| Maximum slew rate | 0.13 mA | 0.14 mA | 0.13 mA | - | 0.14 mA |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V |
| surface mount | YES | YES | YES | - | YES |
| technology | CMOS | CMOS | CMOS | - | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
| Terminal form | GULL WING | J BEND | J BEND | - | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | - | DUAL |