B37871A5680J060 datasheet, PDF

Datasheet> All Categories > Passive components> capacitor> B37871A5680J060

B37871A5680J060: DescriptionCAPACITOR, CERAMIC, MULTILAYER, 50V, C0G, 0.000068uF, SURFACE MOUNT, 1206, CHIP; CategoryPassive components capacitor; File Size186KB，29 Pages; ManufacturerEPCOS (TDK)

Download Datasheet Parametric View All

B37871A5680J060 Overview

CAPACITOR, CERAMIC, MULTILAYER, 50V, C0G, 0.000068uF, SURFACE MOUNT, 1206, CHIP

B37871A5680J060 Parametric

Parameter Name	Attribute value
Maker	EPCOS (TDK)
package instruction	, 1206
Reach Compliance Code	unknow
ECCN code	EAR99
capacitance	0.000068 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
Manufacturer's serial number	B37871
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	5%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
method of packing	TR, CARDBOARD, 7 INCH
positive tolerance	5%
Rated (DC) voltage (URdc)	50 V
size code	1206
surface mount	YES
Temperature characteristic code	C0G
Temperature Coefficient	-/+30ppm/Cel ppm/°C
Terminal surface	NICKEL
Terminal shape	WRAPAROUND

Preview

Download Datasheet

View All

Multilayer ceramic capacitors

Chip capacitors, Advanced series, C0G and X7R

Date:

October 2006

Data Sheet

EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the

information contained therein without EPCOS’ prior express consent is prohibited.

Multilayer ceramic capacitors

Advanced series

General

Criteria for high reliability

Chip

For both OEMs and component manufacturers, high reliability is assured by consistent process

control. If it is assumed that the component manufacturer supplies a defect-free product, then fur-

ther correct processing by the customer forms the basis for perfect operation of the components

and thus the entire application. So the precondition for high quality is not exclusively a particular

“intermediate product“ (such as the ceramic capacitor) but rather the process control along the

entire production chain up to its end point. This requires a high degree of mutual process under-

standing between the various partners (e.g. component manufacturer and placement operator) and

the formulation of joint quality guidelines.

AEC-Q200 is a standard for quality requirements on components in various technologies. In view

of its general character, AEC-Q200 does not apply to every component to the same extent and thus

defines a minimum requirement on quality. AEC-Q200 stipulates the observance of limits that can

be checked by means of a good/bad decision. It therefore permits a qualitative statement but not a

quantitative one. However, it is precisely the latter that is important if we wish to approach “zero

defects”. So process control moves to center stage and becomes the decisive element for ensuring

and continuously improving the maximum possible reliability.

EPCOS has implemented this paradigm change and thus laid the foundation for a zero defect strat-

egy. This concept is integrated in the “ppb level assurance system“ and is particularly realized and

continuously developed further in the Advanced series.

The requirements made on the Advanced series exceed those of AEC-Q200. The criteria are clearly

oriented to the aim of achieving “zero defects”. An important precondition for high component reli-

ability is the production of the ceramic powder at our own plant. Only by knowing all the inter-

relationships and effects from the raw material to the completed component can the self-imposed

quality criteria actually be implemented in all production steps. EPCOS has been developing and

manufacturing its own ceramic powder for ceramic capacitors for many years so that the component

quality can be assured from the first step of manufacture.

ppb level assurance system

The precondition for reliability at ppb level is, apart from process knowledge, a high degree of pro-

cess control. To achieve this, the entire production process is subdivided systematically into sub-

processes that are continuously checked with static methods on the basis of quantifiable parame-

ters. These analysis methods are used by EPCOS within the scope of the Advanced series for all

production steps from ceramic powder production and component design up to the 100% electrical

testing.

Please read

Cautions and warnings

and

Important notes

at the end of this document.

10/06

Recommended Resources

A DM74LS122 retriggered monostable multivibrator

Two motors (or electrical appliances) interlock control circuit

Turn short circuit detector circuit

Electronic distress alarm box

Relay delay suction circuit

EXB850 application circuit

The role and principle analysis of single chip microcomputer crystal oscillator: Each single-chip microcomputer system has a crystal oscillator, which is called a crystal oscillator. The crystal oscillator plays a very important role in the single-chip microcomputer system. It com...; Aguilera Microcontroller MCU

avr studio4 register problem: How can I see the data in the defined variable a in avr studio4? I am very anxious and hope that kind people can help me. Thank you in advance!...; jiayidan6 Microchip MCU

Why is there no memory map for command register, data register, and address register in the NAND01G-B datasheet?: DSP is connected to NAND flash through EMIFA. The model of NAND flash is NAND01GW3A. But why is there no memory mapping address of command register, data register and address register in the datasheet...; georon DSP and ARM Processors

Help: Please recommend a company that can open computer motherboards (x86), thank you 2!: Ask: Our company wants to find a company to make a computer motherboard! Please recommend some companies with this ability! QQ:19335776 EMAIL:LSH9982008@163.COM Thank you!...; leadsky Embedded System

The process of writing bin files to nandflash using openjtag on s3c6410, the problem of nand erase command in openocd: [i=s] This post was last edited by 人丑鬼见愁 on 2015-7-9 18:45 [/i] When s3c6410 uses openjtag to write bin file to nandflash, nand erase command cannot be executed. The problem is shown in the figure...; 人丑鬼见愁 ARM Technology

What is the difference between plug and play and hot swap?: I have searched Google and Baidu for this question, but I still don't understand it. I just touched on the topic of driver development. I hope to get a simple explanation from everyone. Don't give me ...; hzwwqq Embedded System

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components