TC55257CPL-70 datasheet, PDF - EEWORLD Datasheet

TC55257CPL-70: DescriptionSILICON GATE CMOS 32,768 WORD x 8 BIT STATIC RAM; Categorystorage storage; File Size388KB，7 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

Download Datasheet Parametric View All

TC55257CPL-70 Overview

SILICON GATE CMOS 32,768 WORD x 8 BIT STATIC RAM

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	DIP, DIP28,.6
Contacts	28
Reach Compliance Code	unknow
ECCN code	EAR99
Is Samacsys	N
Maximum access time	70 ns
I/O type	COMMON
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	37 mm
memory density	262144 bi
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.3 mm
Maximum standby current	0.00005 A
Minimum standby current	2 V
Maximum slew rate	0.07 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
Base Number Matches	1

How to identify the quality of wireless monitoring equipment?: The price of wireless monitoring equipment ranges from a few hundred to tens of thousands, but each price range has its own advantages. Only the equipment that suits you best is the best equipment. Du...; vfd8888 Industrial Control Electronics

Next-generation wafer-level packaging technology solves various challenges faced by image sensors: Solid-state image sensors require effective protection from the ambient atmosphere. The first generation of image sensors were mounted in a standard semiconductor package with a glass cover. This tech...; songbo PCB Design

To understand the serial data communication between these C6000 and C2000 series DSPs: [p=30, null, left][font=宋体][font=Verdana][color=#a0522d]TMS320C6711 is a 32-bit floating-point DSP of TI's TMS320C6000 series. It has a CPU with dedicated hardware logic, on-chip memory, and on-chip p...; Jacktang Microcontroller MCU

EEWORLD University ---- Power Design Tips 31: Correct Selection of Synchronous Buck MOSFET Resistance Ratio: Power Design Tips 31: Correct Selection of Synchronous Buck MOSFET Resistance Ratio : https://training.eeworld.com.cn/course/485...; dongcuipin Power technology

How to implement user application tracing using Tracealyzer pre-defined logger extension files?: By default, the Tracealyzer recorder library can track and record two types of information: RTOS kernel events such as context switches, and application events such as debug logging, state transitions...; MamoYU Integrated technical exchanges

Basic Phase-Locked Loop: Basic Phase-Locked Loop...; fighting Analog electronics

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components