Standard SRAM, 16KX4, 12ns, ECL, CDFP28, CERAMIC, FP-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Hitachi （Renesas ） |
| Parts packaging code | DFP |
| package instruction | DFP, FL28(UNSPEC) |
| Contacts | 28 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 12 ns |
| I/O type | SEPARATE |
| JESD-30 code | R-GDFP-F28 |
| JESD-609 code | e0 |
| memory density | 65536 bi |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Negative supply voltage rating | -5.2 V |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 28 |
| word count | 16384 words |
| character code | 16000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | |
| organize | 16KX4 |
| Output characteristics | OPEN-EMITTER |
| Exportable | NO |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL28(UNSPEC) |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | -5.2 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.3 mm |
| Maximum slew rate | 0.18 mA |
| surface mount | YES |
| technology | ECL |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| HM101494F-12 | HM101494-10 | HM101494F-10 | HM101494-12 | |
|---|---|---|---|---|
| Description | Standard SRAM, 16KX4, 12ns, ECL, CDFP28, CERAMIC, FP-28 | Standard SRAM, 16KX4, 10ns, ECL, CDIP28, 0.400 INCH, CERDIP-28 | Standard SRAM, 16KX4, 10ns, ECL, CDFP28, CERAMIC, FP-28 | Standard SRAM, 16KX4, 12ns, ECL, CDIP28, 0.400 INCH, CERDIP-28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） |
| Parts packaging code | DFP | DIP | DFP | DIP |
| package instruction | DFP, FL28(UNSPEC) | DIP, DIP28,.4 | DFP, FL28(UNSPEC) | DIP, DIP28,.4 |
| Contacts | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknow | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 12 ns | 10 ns | 10 ns | 12 ns |
| I/O type | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 code | R-GDFP-F28 | R-GDIP-T28 | R-GDFP-F28 | R-GDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| memory density | 65536 bi | 65536 bit | 65536 bit | 65536 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 4 | 4 | 4 | 4 |
| Negative supply voltage rating | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 |
| word count | 16384 words | 16384 words | 16384 words | 16384 words |
| character code | 16000 | 16000 | 16000 | 16000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
| organize | 16KX4 | 16KX4 | 16KX4 | 16KX4 |
| Output characteristics | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
| Exportable | NO | NO | NO | NO |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP | DIP | DFP | DIP |
| Encapsulate equivalent code | FL28(UNSPEC) | DIP28,.4 | FL28(UNSPEC) | DIP28,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | FLATPACK | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.3 mm | 5.3 mm | 2.3 mm | 5.3 mm |
| Maximum slew rate | 0.18 mA | 0.18 mA | 0.18 mA | 0.18 mA |
| surface mount | YES | NO | YES | NO |
| technology | ECL | ECL | ECL | ECL |
| Temperature level | OTHER | OTHER | OTHER | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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