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IBM0418166XLAC-50

Description
Standard SRAM, 1MX18, 2.25ns, CMOS, PBGA119, 17 X 7 MM, BGA-119
Categorystorage    storage   
File Size265KB,25 Pages
ManufacturerIBM
Websitehttp://www.ibm.com
Download Datasheet Parametric Compare View All

IBM0418166XLAC-50 Overview

Standard SRAM, 1MX18, 2.25ns, CMOS, PBGA119, 17 X 7 MM, BGA-119

IBM0418166XLAC-50 Parametric

Parameter NameAttribute value
MakerIBM
Parts packaging codeBGA
package instructionBGA,
Contacts119
Reach Compliance Codeunknow
ECCN code3A991.B.2.A
Maximum access time2.25 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PBGA-B119
length22 mm
memory density18874368 bi
Memory IC TypeSTANDARD SRAM
memory width18
Number of functions1
Number of terminals119
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature
organize1MX18
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height2.679 mm
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width14 mm
.
Preliminary
IBM0436166XLAC
IBM0418166XLAC
16Mb (512K x 36 & 1M x 18) SRAM
Features
• 512K
×
36 or 1M
×
18 organization
• CMOS technology
• Synchronous pipeline mode of operation with
self-timed late write
• Single differential HSTL clock
• HSTL input and output levels
• +2.5V power supply
• Registered addresses, write enables, synchro-
nous select, and data-ins
• Common I/O
• Asynchronous output enable and sleep mode
inputs
• Boundary scan using a limited set of JTAG
1149.1 functions
• Byte write capability and global write enable
• 7
×
17 bump ball grid array (BGA) package with
SRAM JEDEC standard pinout and boundary
scan order
• Programmable impedance output drivers
Description
The IBM0418166XLAC and IBM0436166XLAC
16Mb SRAM
S
are synchronous pipeline mode, high-
performance CMOS static random-access memo-
ries that have wide I/O and achieve 2-ns cycle times.
Single differential K clocks are used to initiate the
read/write operation, and all internal operations are
self-timed. At the rising edge of the K clock, all
addresses, write enables, synchronous selects, and
data-ins are registered internally. Data-outs are
updated from output registers off the next rising
edge of the K clock. An internal write buffer allows
write data to follow one cycle after addresses and
controls. The chip is operated with a single +2.5V
power supply and is compatible with HSTL I/O inter-
faces.
XLACds.fm.00
November 24, 2003
Page 1 of 25

IBM0418166XLAC-50 Related Products

IBM0418166XLAC-50 IBM0418166XLAC-40 IBM0418166XLAC-30
Description Standard SRAM, 1MX18, 2.25ns, CMOS, PBGA119, 17 X 7 MM, BGA-119 Standard SRAM, 1MX18, 2ns, CMOS, PBGA119, 17 X 7 MM, BGA-119 Standard SRAM, 1MX18, 1.5ns, CMOS, PBGA119, 17 X 7 MM, BGA-119
Maker IBM IBM IBM
Parts packaging code BGA BGA BGA
package instruction BGA, BGA, BGA, BGA119,7X17,50
Contacts 119 119 119
Reach Compliance Code unknow unknown unknown
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
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