BGS13GA14
SP3T Diversity Antenna Switch with GPIO Interface
Data Sheet
Revision 3.1 - 2016-11-03
Edition 2016-11-03
Published by Infineon Technologies AG
81726 Munich, Germany
c 2016 Infineon Technologies AG
All Rights Reserved.
LEGAL DISCLAIMER
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics.
With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding
the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon
Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used
in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support device or system or to affect the
safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in
the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to
assume that the health of the user or other persons may be endangered.
BGS13GA14
Revision History
Document No.:
BGS13GA14__v3.1.pdf
Revision History:
Rev. v3.1
Previous Version:
3.0
Page
7
8
Subjects (major changes since last revision)
Ambient temperature range updated in Table 4
Ambient temperature range updated in Table 6
Trademarks of Infineon Technologies AG
µHVIC
,
µIPM
,
µPFC
, AU-ConvertIR , AURIX , C166 , CanPAK , CIPOS , CIPURSE , CoolDP , CoolGaN ,
TM
TM
TM
TM
TM
TM
TM
TM
TM
TM
COOLiR , CoolMOS , CoolSET , CoolSiC , DAVE , DI-POL , DirectFET , DrBlade , EasyPIM , EconoBRIDGE ,
TM
TM
TM
TM
TM
TM
TM
TM
TM
EconoDUAL , EconoPACK , EconoPIM , EiceDRIVER , eupec , FCOS , GaNpowIR , HEXFET , HITFET ,
TM
TM
TM
TM
TM
TM
TM
TM
TM
TM
HybridPACK , iMOTION , IRAM , ISOFACE , IsoPACK , LEDrivIR , LITIX , MIPAQ , ModSTACK , my-d ,
TM
TM
TM
TM
TM
TM
TM
TM
TM
NovalithIC , OPTIGA , OptiMOS , ORIGA , PowIRaudio , PowIRStage , PrimePACK , PrimeSTACK , PROFET ,
TM
TM
TM
TM
TM
TM
TM
TM
TM
PRO-SIL , RASIC , REAL3 , SmartLEWIS , SOLID FLASH , SPOC , StrongIRFET , SupIRBuck , TEMPFET ,
TM
TM
TM
TM
TM
TRENCHSTOP , TriCore , UHVIC , XHP , XMC .
Other Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Trademarks updated November 2015
TM
TM
TM
TM
TM
TM
TM
TM
TM
TM
TM
Data Sheet
3
Revision 3.1 - 2016-11-03
BGS13GA14
Contents
Contents
1 Features
2 Product Description
3 Maximum Ratings
4 Operation Ranges
5 RF Characteristics
6 GPIO Specification
7 Package related information
5
5
6
7
8
9
10
List of Figures
1
2
3
4
5
6
BGS13GA14 block diagram
Footprint, top view . . . . .
Package Outline Drawing .
Land Pattern Drawing . . .
Laser marking . . . . . . .
Carrier Tape . . . . . . . . .
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
6
10
11
11
12
12
List of Tables
1
2
3
4
5
6
7
8
9
10
11
12
Ordering Information . . . .
Maximum Ratings, Table I .
Maximum Ratings, Table II .
Operation Ranges . . . . .
RF Input Power . . . . . . .
RF Characteristics . . . . .
Switching Time . . . . . . .
IMD2 Testcases . . . . . .
IMD3 Testcases . . . . . .
GPIO Truth Table . . . . . .
Mechanical Data . . . . . .
Pin definition . . . . . . . .
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
5
6
7
7
7
8
9
9
9
9
10
10
Data Sheet
4
Revision 3.1 - 2016-11-03
BGS13GA14
BGS13GA14
1 Features
•
3 high-linearity, interchangeable RX ports
•
Low insertion loss
•
Low harmonic generation
•
High port-to-port-isolation
•
Suitable for Edge / C2K / LTE / WCDMA Applications
•
LTE TX Power handling capabilities
•
0.1 to 6.0 GHz coverage
•
No decoupling capacitors required if no DC applied on RF lines
•
On chip control logic including ESD protection
•
General Purpose Input-Output (GPIO) Interface
•
Small form factor 2.0 mm x 2.0 mm
•
No power supply blocking required
•
High EMI robustness
•
RoHS and WEEE compliant package
2 Product Description
The BGS13GA14 is a Single Pole Three Throw (SP3T) Diversity Switch optimized for wireless applications up to
6.0 GHz. It is part of SP3T-SP8T diversity switch family designed to meet the requirements of chipset reference
designs. The module comes in a miniature ATSLP package and comprises of a CMOS SP3T switch with integrated
GPIO interface. This RF switch is a perfect solution for multimode handsets based on LTE and WCDMA. The switch
device configuration is shown in Fig. 1.
The switch is controlled via a GPIO interface. It features DC-free RF ports and unlike GaAs technology, external DC
blocking capacitors at the RF ports are only required if DC voltage is applied externally.
Table 1: Ordering Information
Type
BGS13GA14
Package
ATSLP-14
Marking
G3
Data Sheet
5
Revision 3.1 - 2016-11-03