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IS25LP016D-JULE1

Description
Flash, 2MX8, PDSO8, USON-8
Categorystorage    storage   
File Size2MB,113 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Download Datasheet Parametric View All

IS25LP016D-JULE1 Overview

Flash, 2MX8, PDSO8, USON-8

IS25LP016D-JULE1 Parametric

Parameter NameAttribute value
MakerIntegrated Silicon Solution ( ISSI )
package instructionHVSON,
Reach Compliance Codeunknow
Maximum clock frequency (fCLK)133 MHz
JESD-30 codeR-PDSO-N8
length3 mm
memory density16777216 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals8
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize2MX8
Package body materialPLASTIC/EPOXY
encapsulated codeHVSON
Package shapeRECTANGULAR
Package formSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/SerialSERIAL
Programming voltage3 V
Maximum seat height0.6 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationDUAL
width2 mm

IS25LP016D-JULE1 Preview

IS25LP016D
16Mb
IS25WP016D
SERIAL FLASH MEMORY WITH 133MHZ MULTI I/O SPI &
QUAD I/O QPI DTR INTERFACE
ADVANCED DATA SHEET
IS25LP016D
IS25WP016D
16Mb
SERIAL FLASH MEMORY WITH 133MHZ MULTI I/O SPI &
QUAD I/O QPI DTR INTERFACE
ADVANCED INFORMATION
FEATURES
Industry Standard Serial Interface
-
IS25LP016D: 16Mbit/2Mbyte
-
IS25WP016D: 16Mbit/2Mbyte
-
256 bytes per Programmable Page
-
Supports standard SPI, Fast, Dual, Dual
I/O, Quad, Quad I/O, SPI DTR, Dual I/O
DTR, Quad I/O DTR, and QPI
-
Supports Serial Flash Discoverable
Parameters (SFDP)
High Performance Serial Flash (SPI)
-
50MHz Normal and 133Mhz Fast Read
-
532 MHz equivalent QPI
-
DTR (Dual Transfer Rate) up to 66MHz
-
Selectable Dummy Cycles
-
Configurable Drive Strength
-
Supports SPI Modes 0 and 3
-
More than 100,000 Erase/Program Cycles
-
More than 20-year Data Retention
Flexible & Efficient Memory Architecture
-
Chip Erase with Uniform: Sector/Block
Erase (4/32/64 Kbyte)
-
Program 1 to 256 Bytes per Page
-
Program/Erase Suspend & Resume
Efficient Read and Program modes
-
Low Instruction Overhead Operations
-
Continuous Read 8/16/32/64-Byte
Burst Wrap
-
Selectable Burst Length
-
QPI for Reduced Instruction Overhead
-
AutoBoot Operation
Low Power with Wide Temp. Ranges
-
Single Voltage Supply
IS25LP: 2.30V to 3.60V
IS25WP: 1.65V to 1.95V
-
4 mA Active Read Current (typ.)
-
5 µA Standby Current (typ.)
-
1 µA Deep Power Down (typ.)
-
Temp Grades:
Extended: -40°C to +105°C
Extended+: -40°C to +125°C
Auto Grade: up to +125°C
Note: Extended+ should not be used for Automotive.
Advanced Security Protection
-
Software and Hardware Write Protection
-
Power Supply Lock Protect
-
4x256-Byte Dedicated Security Area
with OTP User-lockable Bits
-
128 bit Unique ID for Each Device
(Call Factory)
Industry Standard Pin-out & Packages
(1,2)
-
B = 8-pin SOIC 208mil
-
N = 8-pin SOIC 150mil
-
V = 8-pin VVSOP 150mil
-
U = 8-contact USON 2x3mm
-
T = 8-contact USON 4x3mm
-
K = 8-contact WSON 6x5mm
-
M = 16-pin SOIC 300mil
(2)
-
G= 24-ball TFBGA 6x8mm 4x6
(2)
-
H = 24-ball TFBGA 6x8mm 5x5 (Call
Factory)
(2)
-
KGD (Call Factory)
-
Notes:
1. Call Factory for other package options available.
2. For the dedicated RESET# option, see the Ordering
Information.
Integrated Silicon Solution, Inc.- www.issi.com
Rev. 00B
06/02/2016
2
IS25LP016D
IS25WP016D
GENERAL DESCRIPTION
The IS25LP016D and IS25WP016D Serial Flash memory offers a versatile storage solution with high flexibility
and performance in a simplified pin count package. ISSI’s “Industry Standard Serial Interface” Flash is for
systems that require limited space, a low pin count, and low power consumption. The device is accessed through
a 4-wire SPI Interface consisting of a Serial Data Input (SI), Serial Data Output (SO), Serial Clock (SCK), and
Chip Enable (CE#) pins, which can also be configured to serve as multi-I/O (see pin descriptions).
The device supports Dual and Quad I/O as well as standard, Dual Output, and Quad Output SPI. Clock
frequencies of up to 133MHz allow for equivalent clock rates of up to 532MHz (133MHz x 4) which equates to
66Mbytes/s of data throughput. The IS25xP series of Flash adds support for DTR (Double Transfer Rate)
commands that transfer addresses and read data on both edges of the clock. These transfer rates can
outperform 16-bit Parallel Flash memories allowing for efficient memory access to support XIP (execute in place)
operation.
The memory array is organized into programmable pages of 256-bytes. This family supports page program mode
where 1 to 256 bytes of data are programmed in a single command. QPI (Quad Peripheral Interface) supports 2-
cycle instruction further reducing instruction times. Pages can be erased in groups of 4Kbyte sectors, 32Kbyte
blocks, 64Kbyte blocks, and/or the entire chip. The uniform sector and block architecture allows for a high degree
of flexibility so that the device can be utilized for a broad variety of applications requiring solid data retention.
GLOSSARY
Standard SPI
In this operation, a 4-wire SPI Interface is utilized, consisting of Serial Data Input (SI), Serial Data Output (SO),
Serial Clock (SCK), and Chip Enable (CE#) pins. Instructions are sent via the SI pin to encode instructions,
addresses, or input data to the device on the rising edge of SCK. The SO pin is used to read data or to check the
status of the device. This device supports SPI bus operation modes (0, 0) and (1, 1).
Multi I/O SPI
Multi-I/O operation utilizes an enhanced SPI protocol to allow the device to function with Dual Output, Dual Input
and Output, Quad Output, and Quad Input and Output capability. Executing these instructions through SPI mode
will achieve double or quadruple the transfer bandwidth for READ and PROGRAM operations.
QPI
The device supports Quad Peripheral Interface (QPI) operations only when the device is switched from
Standard/Dual/Quad SPI mode to QPI mode using the enter QPI (35h) instruction. The typical SPI protocol
requires that the byte-long instruction code being shifted into the device only via SI pin in eight serial clocks. The
QPI mode utilizes all four I/O pins to input the instruction code thus requiring only two serial clocks. This can
significantly reduce the SPI instruction overhead and improve system performance. Only QPI mode or
SPI/Dual/Quad mode can be active at any given time. Enter QPI (35h) and Exit QPI (F5h) instructions are used to
switch between these two modes, regardless of the non-volatible Quad Enable (QE) bit status in the Status
Register. Power Reset or Software Reset will return the device into the standard SPI mode. SI and SO pins
become bidirectional I/O0 and I/O1, and WP# and HOLD# pins become I/O2 and I/O3 respectively during QPI
mode.
DTR
In addition to SPI and QPI features, the device also supports Fast READ DTR operation. Fast READ DTR
operation allows high data throughput while running at lower clock frequencies. Fast READ DTR operation uses
both rising and falling edges of the clock for address inputs, and data outputs, resulting in reducing input and
output cycles by half.
Integrated Silicon Solution, Inc.- www.issi.com
Rev. 00B
06/02/2016
3
IS25LP016D
IS25WP016D
TABLE OF CONTENTS
FEATURES ............................................................................................................................................................ 2
GENERAL DESCRIPTION .................................................................................................................................... 3
TABLE OF CONTENTS ......................................................................................................................................... 4
1.
2.
3.
4.
5.
6.
PIN CONFIGURATION ................................................................................................................................... 7
PIN DESCRIPTIONS ...................................................................................................................................... 9
BLOCK DIAGRAM ........................................................................................................................................ 11
SPI MODES DESCRIPTION ........................................................................................................................ 12
SYSTEM CONFIGURATION ........................................................................................................................ 14
5.1 BLOCK/SECTOR ADDRESSES ............................................................................................................ 14
REGISTERS ................................................................................................................................................. 15
6.1 STATUS REGISTER .............................................................................................................................. 15
6.2 FUNCTION REGISTER .......................................................................................................................... 18
6.3 READ REGISTER AND EXTENDED REGISTER .................................................................................. 19
6.4 AUTOBOOT REGISTER ........................................................................................................................ 23
7.
PROTECTION MODE................................................................................................................................... 24
7.1 HARDWARE WRITE PROTECTION...................................................................................................... 24
7.2 SOFTWARE WRITE PROTECTION ...................................................................................................... 24
8.
DEVICE OPERATION .................................................................................................................................. 25
8.1 NORMAL READ OPERATION (NORD, 03h) ......................................................................................... 28
8.2 FAST READ OPERATION (FRD, 0Bh) .................................................................................................. 30
8.3 HOLD OPERATION ................................................................................................................................ 32
8.4 FAST READ DUAL I/O OPERATION (FRDIO, BBh) ............................................................................. 32
8.5 FAST READ DUAL OUTPUT OPERATION (FRDO, 3Bh) ..................................................................... 35
8.6 FAST READ QUAD OUTPUT OPERATION (FRQO, 6Bh).................................................................... 36
8.7 FAST READ QUAD I/O OPERATION (FRQIO, EBh) ............................................................................ 38
8.8 PAGE PROGRAM OPERATION (PP, 02h) ............................................................................................ 42
8.9 QUAD INPUT PAGE PROGRAM OPERATION (PPQ, 32h/38h) .......................................................... 44
8.10 ERASE OPERATION ........................................................................................................................... 45
8.11 SECTOR ERASE OPERATION (SER, D7h/20h) ................................................................................. 46
8.12 BLOCK ERASE OPERATION (BER32K:52h, BER64K:D8h) .............................................................. 47
8.13 CHIP ERASE OPERATION (CER, C7h/60h) ....................................................................................... 49
8.14 WRITE ENABLE OPERATION (WREN, 06h) ...................................................................................... 50
8.15 WRITE DISABLE OPERATION (WRDI, 04h) ....................................................................................... 51
8.16 READ STATUS REGISTER OPERATION (RDSR, 05h) ..................................................................... 52
8.17 WRITE STATUS REGISTER OPERATION (WRSR, 01h) ................................................................... 53
8.18 READ FUNCTION REGISTER OPERATION (RDFR, 48h) ................................................................. 54
8.19 WRITE FUNCTION REGISTER OPERATION (WRFR, 42h)............................................................... 55
8.20 ENTER QUAD PERIPHERAL INTERFACE (QPI) MODE OPERATION (QPIEN, 35h; QPIDI, F5h) .. 56
Integrated Silicon Solution, Inc.- www.issi.com
Rev. 00B
06/02/2016
4
IS25LP016D
IS25WP016D
8.21 PROGRAM/ERASE SUSPEND & RESUME ........................................................................................ 57
8.22 ENTER DEEP POWER DOWN (DP, B9h) ........................................................................................... 59
8.23 RELEASE DEEP POWER DOWN (RDPD, ABh) ................................................................................. 60
8.24 SET READ PARAMETERS OPERATION (SRPNV: 65h, SRPV: C0h/63h) ........................................ 61
8.25 SET EXTENDED READ PARAMETERS OPERATION (SERPNV: 85h, SERPV: 83h) ...................... 63
8.26 READ READ PARAMETERS OPERATION (RDRP, 61h) ................................................................... 64
8.27 READ EXTENDED READ PARAMETERS OPERATION (RDERP, 81h) ............................................ 65
8.28 CLEAR EXTENDED READ PARAMETERS OPERATION (CLERP, 82h) .......................................... 66
8.29 READ PRODUCT IDENTIFICATION (RDID, ABh) .............................................................................. 67
8.30 READ PRODUCT IDENTIFICATION BY JEDEC ID OPERATION (RDJDID, 9Fh; RDJDIDQ, AFh) .. 69
8.31 READ DEVICE MANUFACTURER AND DEVICE ID OPERATION (RDMDID, 90h) .......................... 70
8.31 READ UNIQUE ID NUMBER (RDUID, 4Bh) ........................................................................................ 71
8.32 READ SFDP OPERATION (RDSFDP, 5Ah) ........................................................................................ 72
8.33 NO OPERATION (NOP, 00h) ............................................................................................................... 72
8.34 SOFTWARE RESET (RESET-ENABLE (RSTEN, 66h) AND RESET (RST, 99h)) AND HARDWARE
RESET .......................................................................................................................................................... 73
8.35 SECURITY INFORMATION ROW ........................................................................................................ 74
8.36 INFORMATION ROW ERASE OPERATION (IRER, 64h) ................................................................... 75
8.37 INFORMATION ROW PROGRAM OPERATION (IRP, 62h) ............................................................... 76
8.38 INFORMATION ROW READ OPERATION (IRRD, 68h) ..................................................................... 77
8.39 FAST READ DTR MODE OPERATION In SPI MODE (FRDTR, 0Dh) ................................................ 78
8.40 FAST READ DUAL IO DTR MODE OPERATION (FRDDTR, BDh) .................................................... 80
8.41 FAST READ QUAD IO DTR MODE OPERATION IN SPI MODE (FRQDTR, EDh) ............................ 83
8.42 SECTOR LOCK/UNLOCK FUNCTIONS .............................................................................................. 87
8.43 AUTOBOOT .......................................................................................................................................... 89
9.
ELECTRICAL CHARACTERISTICS............................................................................................................. 93
9.1 ABSOLUTE MAXIMUM RATINGS
(1)
..................................................................................................... 93
9.2 OPERATING RANGE ............................................................................................................................. 93
9.3 DC CHARACTERISTICS ........................................................................................................................ 94
9.4 AC MEASUREMENT CONDITIONS ...................................................................................................... 95
9.5 PIN CAPACITANCE ............................................................................................................................... 95
9.6 AC CHARACTERISTICS ........................................................................................................................ 96
9.7 SERIAL INPUT/OUTPUT TIMING .......................................................................................................... 98
9.8 POWER-UP AND POWER-DOWN ...................................................................................................... 100
9.9 PROGRAM/ERASE PERFORMANCE ................................................................................................. 101
9.10 RELIABILITY CHARACTERISTICS ................................................................................................... 101
10.
PACKAGE TYPE INFORMATION ......................................................................................................... 102
10.1 8-Pin JEDEC 208mil Broad Small Outline Integrated Circuit (SOIC) Package (B) ............................ 102
10.2 8-Pin JEDEC 150mil Broad Small Outline Integrated Circuit (SOIC) Package (N) ............................ 103
10.3 8-Pin 150mil VVSOP Package (V)...................................................................................................... 104
Integrated Silicon Solution, Inc.- www.issi.com
Rev. 00B
06/02/2016
5

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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