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IS61LPS12836EC-200B2

Description
Cache SRAM, 128KX36, 3.1ns, CMOS, PBGA119, BGA-119
Categorystorage    storage   
File Size2MB,36 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Download Datasheet Parametric View All

IS61LPS12836EC-200B2 Overview

Cache SRAM, 128KX36, 3.1ns, CMOS, PBGA119, BGA-119

IS61LPS12836EC-200B2 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeBGA
package instructionBGA, BGA119,7X17,50
Contacts119
Reach Compliance Codecompli
ECCN code3A991.B.2.A
Maximum access time3.1 ns
Maximum clock frequency (fCLK)200 MHz
I/O typeCOMMON
JESD-30 codeR-PBGA-B119
length22 mm
memory density4718592 bi
Memory IC TypeCACHE SRAM
memory width36
Number of functions1
Number of terminals119
word count131072 words
character code128000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA119,7X17,50
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply2.5,2.5/3.3 V
Certification statusNot Qualified
Maximum seat height3.5 mm
Maximum standby current0.08 A
Minimum standby current3.14 V
Maximum slew rate0.21 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width14 mm
IS61(4)LPS12836EC/IS61(4)VPS12836EC/IS61(4)LPS12832EC
IS61(4)VPS12832EC/IS61(4)LPS25618EC/IS61(4)VPS25618EC
128K x36/32 and 256K x18 4Mb, ECC, SYNCHRONOUS PIPELINED,
SINGLE CYCLE DESELECT SRAM
APRIL 2014
FEATURES
Internal self-timed write cycle
Individual Byte Write Control and Global Write
Clock controlled, registered address, data and
control
Burst sequence control using MODE input
Three chip enable option for simple depth
expansion and address pipelining
Common data inputs and data outputs
Auto Power-down during deselect
Single cycle deselect
Snooze MODE for reduced-power standby
JEDEC 100-pin QFP, 165-ball BGA and 119-
ball BGA packages
Power supply:
LPS: V
DD
3.3V (± 5%), V
DDQ
3.3V/2.5V (± 5%)
VPS: V
DD
2.5V (± 5%), V
DDQ
2.5V (± 5%)
JTAG Boundary Scan for BGA packages
Industrial and Automotive temperature support
Lead-free available
Error Detection and Error Correction
Write cycles are internally self-timed and are initiated
by the rising edge of the clock input. Write cycles can
be one to four bytes wide as controlled by the write
control inputs.
Separate byte enables allow individual bytes to be
written. The byte write operation is performed by using
the byte write enable (/BWE) input combined with one
or more individual byte write signals (/BWx). In
addition, Global Write (/GW) is available for writing all
bytes at one time, regardless of the byte write controls.
Bursts can be initiated with either /ADSP (Address
Status Processor) or /ADSC (Address Status Cache
Controller) input pins. Subsequent burst addresses can
be generated internally and controlled by the /ADV
(burst address advance) input pin.
The mode pin is used to select the burst sequence
order. Linear burst is achieved when this pin is tied
LOW. Interleave burst is achieved when this pin is tied
HIGH or left floating
DESCRIPTION
The 4Mb product family features high-speed, low-
power synchronous static RAMs designed to provide
burstable, high-performance memory for
communication and networking applications. The
IS61(64)LPS/VPS12836EC
are organized as
131,072
words
by 36bits. The
IS61(64)LPS/VPS12832EC
are organized as
131,072
words by 32bits. The
IS61(64)LPS/VPS25618EC
are
organized as
262,144
words by 18 bits. Fabricated with
ISSI's advanced CMOS technology, the device
integrates a 2-bit burst counter, high-speed SRAM
core, and high-drive capability outputs into a single
monolithic circuit. All synchronous inputs pass through
registers controlled by a positive-edge-triggered single
clock input.
FAST ACCESS TIME
Symbol
t
KQ
t
KC
f
MAX
Parameter
Clock Access Time
Cycle time
Frequency
-250
2.6
4
250
-200
3.1
5
200
Units
ns
ns
MHz
Copyright © 2014 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such
applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.- www.issi.com
Rev. C
03/19/2014
1
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