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LFX200B-04FN516C

Description
Field Programmable Gate Array, 676 CLBs, 210000 Gates, 320MHz, 2704-Cell, CMOS, PBGA516, LEAD FREE, FPBGA-256
CategoryProgrammable logic devices    Programmable logic   
File Size458KB,114 Pages
ManufacturerLattice
Websitehttp://www.latticesemi.com
Environmental Compliance
Download Datasheet Parametric View All

LFX200B-04FN516C Overview

Field Programmable Gate Array, 676 CLBs, 210000 Gates, 320MHz, 2704-Cell, CMOS, PBGA516, LEAD FREE, FPBGA-256

LFX200B-04FN516C Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerLattice
Parts packaging codeBGA
package instructionLEAD FREE, FPBGA-256
Contacts516
Reach Compliance Codecompli
ECCN codeEAR99
Other featuresALSO OPERATES WITH 3.3V SUPPLY
maximum clock frequency320 MHz
Combined latency of CLB-Max0.93 ns
JESD-30 codeS-PBGA-B516
JESD-609 codee1
length31 mm
Humidity sensitivity level3
Configurable number of logic blocks676
Equivalent number of gates210000
Number of entries208
Number of logical units2704
Output times208
Number of terminals516
Maximum operating temperature70 °C
Minimum operating temperature
organize676 CLBS, 210000 GATES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA516,30X30,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)250
power supply2.5/3.3 V
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Certification statusNot Qualified
Maximum seat height2.6 mm
Maximum supply voltage2.7 V
Minimum supply voltage2.3 V
Nominal supply voltage2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width31 mm
April 2007
Includes
High-
,
Performance
Low-Cost
“E-Series”
ispXPGA Family
®
Data Sheet
Non-volatile, Infinitely Reconfigurable
• Instant-on - Powers up in microseconds via
on-chip E
2
CMOS
®
based memory
• No external configuration memory
• Excellent design security, no bit stream to intercept
• Reconfigure SRAM based logic in milliseconds
• Microprocessor configuration interface
• Program E
2
CMOS while operating from SRAM
Eight sysCLOCK™ Phase Locked Loops
(PLLs) for Clock Management
True PLL technology
10MHz to 320MHz operation
Clock multiplication and division
Phase adjustment
Shift clocks in 250ps steps
High Logic Density for System-level
Integration
139K to 1.25M system gates
160 to 496 I/O
1.8V, 2.5V, and 3.3V V
CC
operation
Up to 414Kb sysMEM™ embedded memory
sysIO™ for High System Performance
• High speed memory support through SSTL and
HSTL
• Advanced buses supported through PCI, GTL+,
LVDS, BLVDS, and LVPECL
• Standard logic supported through LVTTL,
LVCMOS 3.3, 2.5 and 1.8
• 5V tolerant I/O for LVCMOS 3.3 and LVTTL
interfaces
• Programmable drive strength for series termination
• Programmable bus maintenance
High Performance Programmable Function
Unit (PFU)
• Four LUT-4 per PFU supports wide and narrow
functions
• Dual flip-flops per LUT-4 for extensive pipelining
• Dedicated logic for adders, multipliers, multiplex-
ers, and counters
Flexible Memory Resources
• Multiple sysMEM Embedded RAM Blocks
– Single port, Dual port, and FIFO operation
• 64-bit distributed memory in each PFU
– Single port, Double port, FIFO, and Shift
Register operation
Two Options Available
• High-performance sysHSI (standard part number)
• Low-cost, no sysHSI (“E-Series”)
Flexible Programming, Reconfiguration,
and Testing
• Supports IEEE 1532 and 1149.1
Table 1. ispXPGA Family Selection Guide
ispXPGA 125/E
System Gates
PFUs
LUT-4s
Logic FFs
sysMEM Memory
Distributed Memory
EBR
sysHSI Channels
1
User I/O
Packaging
139K
484
1936
3.8K
92K
30K
20
4
160/176
256 fpBGA
516 fpBGA
2
sysHSI™ Capability for Ultra Fast Serial
Communications
• Up to 800Mbps performance
• Up to 20 channels per device
• Built in Clock Data Recovery (CDR) and
Serialization and De-serialization (SERDES)
ispXPGA 200/E
210K
676
2704
5.4K
111K
43K
24
8
160/208
256 fpBGA
516 fpBGA
2
ispXPGA 500/E
476K
1764
7056
14.1K
184K
112K
40
12
336
516 fpBGA
2
900 fpBGA
ispXPGA 1200/E
1.25M
3844
15376
30.7K
414K
246K
90
20
496
680 fpSBGA
2
900 fpBGA
1. “E-Series” does not support sysHSI.
2. Thermally enhanced package.
© 2007 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
1
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