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S29GL128N11FFI023

Description
Flash, 8MX16, 110ns, PBGA64,
Categorystorage    storage   
File Size3MB,108 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Environmental Compliance
Download Datasheet Parametric View All

S29GL128N11FFI023 Overview

Flash, 8MX16, 110ns, PBGA64,

S29GL128N11FFI023 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerAMD
package instructionBGA, BGA64,8X8,40
Reach Compliance Codeunknow
Maximum access time110 ns
Spare memory width8
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeS-PBGA-B64
memory density134217728 bi
Memory IC TypeFLASH
memory width16
Number of departments/size128
Number of terminals64
word count8388608 words
character code8000000
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8MX16
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA64,8X8,40
Package shapeSQUARE
Package formGRID ARRAY
page size8/16 words
Parallel/SerialPARALLEL
power supply3/3.3 V
Certification statusNot Qualified
ready/busyYES
Department size128K
Maximum standby current0.000005 A
Maximum slew rate0.09 mA
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
switch bitYES
typeNOR TYPE
S29GL-N MirrorBit™ Flash Family
S29GL512N, S29GL256N, S29GL128N
512 Megabit, 256 Megabit, and 128 Megabit,
3.0 Volt-only Page Mode Flash Memory featuring
110 nm MirrorBit™ Process Technology
ADVANCE
INFORMATION
Notice to Readers:
The Advance Information status indicates that this
document contains information on one or more products under development
at Spansion LLC. The information is intended to help you evaluate this product.
Do not design in this product without contacting the factory. Spansion LLC
reserves the right to change or discontinue work on this proposed product
without notice.
Publication Number
S29GL-N_00
Revision
A
Amendment
7
Issue Date
February 14, 2005
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