MQSMAJ4481CE3 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> diode> MQSMAJ4481CE3

MQSMAJ4481CE3: DescriptionZener Diode, 47V V(Z), 2%, 1.5W, Silicon, Unidirectional, DO-214BA, ROHS COMPLIANT, PLASTIC, SMAJ, 2 PIN; CategoryDiscrete semiconductor diode; File Size157KB，2 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com; Environmental Compliance

Download Datasheet Parametric View All

MQSMAJ4481CE3 Overview

Zener Diode, 47V V(Z), 2%, 1.5W, Silicon, Unidirectional, DO-214BA, ROHS COMPLIANT, PLASTIC, SMAJ, 2 PIN

MQSMAJ4481CE3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microsemi
Parts packaging code	DO-214BA
package instruction	R-PDSO-C2
Contacts	2
Reach Compliance Code	unknow
ECCN code	EAR99
Other features	HIGH RELIABILITY, METALLURGICALLY BONDED
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
JEDEC-95 code	DO-214BA
JESD-30 code	R-PDSO-C2
JESD-609 code	e3
Number of components	1
Number of terminals	2
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
polarity	UNIDIRECTIONAL
Maximum power dissipation	1.5 W
Certification status	Not Qualified
Nominal reference voltage	47 V
surface mount	YES
technology	ZENER
Terminal surface	MATTE TIN
Terminal form	C BEND
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Maximum voltage tolerance	2%
Working test current	5.5 mA

Preview

Download Datasheet

View All

SMAJ4460 thru SMAJ4496, e3

and SMAJ6485 thru SMAJ6491, e3

1.5 Watt Zener Diodes

SCOTTSDALE DIVISION

DESCRIPTION

This 1.5 watt zener series in a low-profile light-weight plastic surface mount

configuration, with stress-relief J-bend contacts, meets or exceeds the electrical

performance of the 1N4460 thru 1N4496 and 1N6485 thru 1N6491. It also provides

double the overall surge performance by using a larger active die element. This

includes ESD protection per IEC61000-4-2, EFT protection per IEC61000-4-4, and

higher surge levels defined herein. The low-flat profile provides easier insertion or

automatic handling compared to other MELF style packages. Its thermally efficient

design lowers junction temperatures and extends operating temperature range

before derating begins. Power derates to zero at 150°C for these plastic packages.

IMPORTANT:

For the most current data, consult

MICROSEMI’s

website:

http://www.microsemi.com

SURFACE MOUNT

ZENER

WWW .

Microsemi

DO-214BA or AC

(SMAJ)

FEATURES

•

Zener voltages: 3.3 volts to 200 volts

Metallurgically bonded

Reliability data per JESD22-A108, JESD22-A104,

JESD22-A113-B, JESD22-A101-B, and JESD22-A102

Thermally efficient surface mount with J-bends for

stress relief (flat handling surface for easier placement)

Options for screening in accordance with MIL-PRF-

19500/406 for JAN, JANTX, and JANTXV are available

by adding MQ, MX, or MV prefixes respectively to part

numbers. For example, designate a MXSMAJ4460 for a

JANTX screen.

RoHS Compliant devices available by adding “e3” suffix

APPLICATIONS / BENEFITS

•

For high reliability voltage regulation in low profile

surface mount locations requiring easy

placement and strain relief

•

Light weight for airborne or satellite applications

•

Superior surge quality to protect from ESD and

EFT transients per IEC61000-4-2 and -4-4 and

higher surge levels defined herein

MECHANICAL AND PACKAGING

•

Molded epoxy package meets UL94V-0

•

Terminals: Tin-lead or RoHS compliant annealed

matte-Tin plated solderable per MIL-STD-750,

method 2026

•

Body marked with P/N without SMAJ letters

(ie. 4460, 4496, 6485, 4460, etc.)

•

Polarity is indicated by cathode band

•

Weight: 0.064 grams (approximate)

•

Tape & Reel packaging per EIA-481-2 with 12

mm tape and 2500 units per reel (13 inch reel)

•

MAXIMUM RATINGS

•

Operating temperature: -55°C to +150°C

Storage temperature: -55°C to +150°C

1.5 watt steady-state maximum power

Thermal resistance, R

θJL

= 15 °C/W

Solder Temperatures: 260ºC for 10 s (maximum)

POWER DERATING – OUTLINE – MOUNTING PAD

Maximum Power Dissipation (Watts)

DIM

DIMENSIONS

MILLIMETERS

INCHES

MIN

MAX

MIN

MAX

.052

.103

1.32

2.62

.160

.180

4.06

4.57

.100

.110

2.54

2.79

.194

.216

4.93

5.49

.078

.115

1.98

2.92

.030

.060

0.76

1.52

.005

0.13

2.5

2.0

1.5

1.0

0.5

SMAJ4460 – SMAJ4496 &

SMAJ6485 – SMAJ6491

DIMENSION A IS WITHIN DO-214BA BUT HIGHER THAN

STANDARD JEDEC OUTLINES..DIMENSION B IS WIDER

THAN BOTH JEDEC OUTLINES FOR LOWER THERMAL

RESISTANCE

75 100 125 150 175 200

Outline

, Lead Temperature (ºC) 3/8” from body

Figure 1. Power Derating Curve

Mounting Pad

2007

6-20-07 REV B

Microsemi

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

Page 1

Recommended Resources

OBC controller system

Large range 7~40V to 5VDC-DC step-down circuit diagram

Use BH-SK-1 to make non-contact infrared light switch

ZLDB is used for electric motor star-delta starter

555 household earthquake sound and light alarm circuit

Gas sensor and its circuit

High Energy Collection AD7606 ADCV2.0 What's it like? (Part 2): [size=4] In the last post, I shared with you the hardware and functions of AD7606 ADCV2.0. Then I made a transfer board adjustment program according to the technical documents of AD7606. From not bein...; bqgup Creative Market

[TI Third-party News] Only 298 yuan! Feiling launches ultra-low-cost industrial-grade Cortex-A8 development platform: [font=微软雅黑] Recently, Feiling Embedded will join hands with Texas Instruments (TI) to launch an ultra-low-cost Cortex-A8 development platform - OK335xS-Ⅱ development board. The platform adopts the AM3...; EEWORLD社区 DSP and ARM Processors

【M4 Learning 1】Chatting with TI's FAE about the differences between M3 and M4: Yesterday, TI's FAE from Chengdu came to our company to promote M4. They were also quite shocked when I got the M4 development board. It is said that there are only about 20 in the whole China, and th...; fengzhang2002 Microcontroller MCU

[Learning Development Board] iTOP-4412 Development Board AVIN Driver Configuration: [align=left][font=宋体][size=10.5pt]This article is transferred from[/size][/font][font=Calibri][size=10.5pt]:[/size][/font][url=http://www.topeetboard.com]http://www.topeetboard.com[/url][/align][align...; Chihiro ARM Technology

STM32F407 issues with ST-link download: st-link download failed, always reports an error....; 电子-------- stm32/stm8

Problems with SDK uninstallation in EVC and workspace deletion in PB: Software: evc4, platform builder5.0 Question: 1. After installing many SDKs, I want to uninstall some of them that are not needed. However, after uninstalling and deleting the corresponding SDK folder...; yangjie050322 Embedded System

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components