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ZL50407GDC

Description
DATACOM, LAN SWITCHING CIRCUIT, PBGA208, 17 X 17 MM, 1.40 MM HEIGHT, MO-192, LBGA-208
CategoryWireless rf/communication    Telecom circuit   
File Size2MB,135 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric Compare View All

ZL50407GDC Overview

DATACOM, LAN SWITCHING CIRCUIT, PBGA208, 17 X 17 MM, 1.40 MM HEIGHT, MO-192, LBGA-208

ZL50407GDC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeBGA
package instructionLBGA, BGA208,16X16,40
Contacts208
Reach Compliance Codecompli
JESD-30 codeS-PBGA-B208
JESD-609 codee0
length17 mm
Humidity sensitivity level3
Number of functions1
Number of terminals208
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA208,16X16,40
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)225
power supply1.8,3.3 V
Certification statusNot Qualified
Maximum seat height1.4 mm
Nominal supply voltage1.8 V
surface mountYES
Telecom integrated circuit typesLAN SWITCHING CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width17 mm
ZL50407
Lightly Managed/Unmanaged 8FE + 1GE
Layer-2 Ethernet Switch
Data Sheet
Zarlink Features
Integrated Single-Chip 10/100/1000 Mbps
Ethernet Switch
• Eight 10/100 Mbps auto-negotiating Fast
Ethernet (FE) ports with RMII, MII, GPSI,
Reverse MII & Reverse GPSI interface options
• One 10/100/1000 Mbps auto-negotiating port
with GMII & MII interface options, that can be
used as a WAN uplink or as a 9th port
Embedded 2.0 Mbits (256 KBytes) internal
memory for control databases and frame data
buffer
• Supports jumbo frames up to 4 KBytes
CPU access supports the following interface
options:
• Serial interface in lightly managed mode, or in
unmanaged mode with optional I
2
C EEPROM
interface
Operates stand-alone or can be cascaded with a
second ZL50407 to reach 16 ports
Ethernet IEEE 802.3x flow control for full duplex
ports, back pressure flow control for half duplex
ports
Built-in reset logic triggered by system
malfunction
Built-In Self Test for internal SRAM
Ordering Information
ZL50407GDC
ZL50407GDG2
208-Ball LBGA
208-Ball LBGA**
August 2006
**Pb Free Tin/Silver/Copper
-40°C to +85°C
IEEE-1149.1 (JTAG) test port
L2 Switching
L2 switching
• MAC address self learning, up to 4 K MAC
addresses
• MAC address table supports unicast MAC
address learning
Supports the following spanning standards
• IEEE 802.1D spanning tree
• IEEE 802.1w rapid spanning tree
Supports Ethernet multicasting and broadcasting
and flooding control
VLAN Support Features
C
P
U
Serial
ZL50407
GMII / MII
8-Port 10/100M + 1G
Ethernet Switch
EEPROM
I
2
C
10/100/
1000
PHY
RMII / MII / GPSI
Quad
10/100
PHY
Quad
10/100
PHY
Figure 1 - System Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003-2006, Zarlink Semiconductor Inc. All Rights Reserved.

ZL50407GDC Related Products

ZL50407GDC
Description DATACOM, LAN SWITCHING CIRCUIT, PBGA208, 17 X 17 MM, 1.40 MM HEIGHT, MO-192, LBGA-208
Is it lead-free? Contains lead
Is it Rohs certified? incompatible
Maker Microsemi
Parts packaging code BGA
package instruction LBGA, BGA208,16X16,40
Contacts 208
Reach Compliance Code compli
JESD-30 code S-PBGA-B208
JESD-609 code e0
length 17 mm
Humidity sensitivity level 3
Number of functions 1
Number of terminals 208
Maximum operating temperature 85 °C
Minimum operating temperature -40 °C
Package body material PLASTIC/EPOXY
encapsulated code LBGA
Encapsulate equivalent code BGA208,16X16,40
Package shape SQUARE
Package form GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) 225
power supply 1.8,3.3 V
Certification status Not Qualified
Maximum seat height 1.4 mm
Nominal supply voltage 1.8 V
surface mount YES
Telecom integrated circuit types LAN SWITCHING CIRCUIT
Temperature level INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb)
Terminal form BALL
Terminal pitch 1 mm
Terminal location BOTTOM
Maximum time at peak reflow temperature 30
width 17 mm

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