ZL60505
Parallel Fiber Optic Transceiver
(4 + 4) x 3.125 Gbps
Data Sheet
July 2009
Ordering Information
ZL60505MKDB QSFP Transceiver
0°C to +70°C
Applications
Features
•
•
•
QSFP MSA compatible
Four independently addressable transmit and
receive channels
Highly compact: saving of 60% on edge and
board usage compared to four comparable SFP
modules
Differential, internally AC-coupled data I/Os
Electrically z-pluggable, allowing port population
on demand
Electrically hot-pluggable
XFP-like latch mechanism for ease-of-insertion
Digital Diagnostics Monitoring Interface. Allows
customer management and monitoring of key
modules parameters, analogous to SFP
Optical connectivity via industry standard
MPO/MTP terminated fiber ribbon
•
•
•
•
•
•
•
High-speed interconnects within and between
switches, routers and transport equipment
Server-Server Clusters, Super-computing
interconnections
Proprietary backplanes
Interconnects rack-to-rack, shelf-to-shelf, board-
to-board, board-to-optical backplane
XAUI over fiber-ribbon
2xGbE applications
InfiniBand SDR applications
•
•
•
•
•
•
Tx1p
Tx1n
1
TIA/LA
Tx4p
Tx4n
Rx1p
Rx1n
Rx4p
Rx4n
PIN
Array
2
3
4
4
VCSEL
Driver
V
CC
Rx
V
CC
Tx
V
CC
1
GND
VCSEL
Array
3
2
1
Laser Diode Supervisor
Diagnostic Supervisor
SCL
SDA
ModPrsL
IntL ModSelL
LPMode
ResetL
Figure 1 - ZL60505 QSFP Parallel Fiber Optic Transceiver
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2009, Zarlink Semiconductor Inc. All Rights Reserved.
ZL60505
Description
Data Sheet
Quad Small Form Factor Pluggable (QSFP) modules are the next generation of pluggable modules intended for
high density applications. A QSFP module is a parallel fiber optical transceiver module with four independent
optical transmit and receive channels. It combines the higher density attractions of parallel modules with some of
the key advantages normally associated with SFP based modules.
It is intended for use in switches, routers and data center applications where it provides:
•
•
•
•
a saving of greater than 60% in edge and board density as compared to the use of four SFP modules. This
allows the end-user to shrink system size and lower overall costs.
simplified heat management through reduction in power consumption of > 50% compared to 4xSFP solution.
z-axis electrically hot-pluggability allowing port population on demand and in the field. Utilises XFP-like
latching mechanism into board mounted cage.
a digital diagnostic monitoring interface similar to that used by SFP modules. This allows customer access to
key module parameters as well as providing alarm and warning flags. This improves customer system
management capability.
The QSFP also benefits from the existence of a multi-source agreement (MSA) which defines the mechanical form-
factor, electrical pin-out and diagnostic management interface.
Reliability assurance is based on Telcordia GR-468-CORE and the parts are compliant to the EU directive
2002/95/EC issued 27 January 2003 [RoHS].
2
Zarlink Semiconductor Inc.
Below is a listing of the datums, for various components, referenced to in this document.
Datum
A
B
C
D
E
F
G
H
J
K
L
M
X&Y
Description
Host Board top surface
Centerline of bezel
Distance between Connector terminal thru holes on host board
Hard stop on transceiver
W idth of transceiver
Height of transceiver housing
W idth of transceiver pc board
Leading edge of signal contact pads on transceiver pc board
Top surface of transceiver pc board
Host Board thru hole #1 to accept connector guide post
Host Board thru hole #2 to accept connector guide post
W idth of bezel cut-out
Host board horizontal and depth datum established by customers’ fiducials
Projection Method
© Zarlink Semiconductor 2007. All rights reserved.
Package code
Previous package codes
ISSUE
ACN
DATE
APPRD.
1
116641 Rev 1
2
116641 Rev 2
3
116641 Rev 3
116641 Rev 4
MK
Drawing type
QSFP Definition of datums
Title
12-JUL-06 15-MAR-07 20-FEB-09 25-MAR-09
M.Andersson M.Andersson M.Andersson M.Andersson
116641
Label
For label contents, see separate drawing.
j
0,1 E
DETAIL VIEW B
Contact pad numbers 21, 22, 36 and 37 are visible.
D
H
13,68
`
0,1
(16,4)
19 MAX
Applies for section that
extends outside of cage.
15,5 TYP
8
3,2
`
0,1
2,5
48,4
`
0,2
29,6
`
0,1
D
4,25
`
0,15
1,7
`
0,1
5,2
`
0,15
8,5
`
0,1
1,1
`
0,18
o
1,5 MIN
c
0,075
Optical
q
2,3
2 MIN
Label
For label contents, see separate drawing.
0,6
`
0,05
0,5
`
0,2
5,5 MIN
j
0,1 F
3,6 MIN
2,25
`
0,1
2
`
0,15
F
0,5 MIN
n
3
`
0,1 Thru hole
q
of E
A
DETAIL VIEW A
Break out view of Latch mechanism.
7,8
2,2 MIN
NOTES:-
1. All dimensions in mm.
2. Gen. tol. ISO-2768-mK
33,4 in locked position.
35,7 in un-locked position.
13 MIN
16,5 MIN
32 MIN
6
`
0,2
(2x)
18,35
`
0,1
1,1 MAX
10,7
B
Valid for 48,4
`
0,2
E
Flatness tolerance applies for indicated area.
Surface thermally conductive.
4,4
`
0,2
Projection Method
© Zarlink Semiconductor 2007. All rights reserved.
Package code
Previous package codes
ISSUE
ACN
DATE
APPRD.
1
116641 Rev 1
2
116641 Rev 2
3
116641 Rev 3
4
116641 Rev 4
MK
Drawing type
QSFP Transceiver
Title
12-JUL-06 15-MAR-07 20-FEB-09 25-MAR-09
M.Andersson M.Andersson M.Andersson M.Andersson
116641
TOP VIEW OF MODULE PCB
H
1,55 MIN
0,9
`
0,05
0,8 MIN
0,4
`
0,05
G
BOTTOM VIEW OF MODULE PCB
H
1,55 MIN
0,9
`
0,05
0,8 MIN
0,4
`
0,05
38
19
0,8 (18x)
0,8 (18x)
0,6
`
0,05
1
PCB Top surface
Solder mask keep out area
Solder mask keep out area
7,4
q
of G
0,6
`
0,05
7
16,4
`
0,1
q
of G
20
1,45
`
0,1
J
NOTES:-
1. All dimensions in mm.
2. Contact pad plating: 0,38 µm MIN Au over 1,27 µm MIN Ni.
j
0,2 J G H
19x
j
0,1 J G
0,3 x45
~
MIN (2x)
Projection Method
7
j
0,2 J G H
7,4
19x
j
0,1 J G
© Zarlink Semiconductor 2007. All rights reserved.
Package code
Previous package codes
ISSUE
ACN
DATE
APPRD.
1
116641 Rev 1
2
116641 Rev 2
3
116641 Rev 3
4
116641 Rev 4
MK
Drawing type
Pattern layout for QSFP PCB
Title
12-JUL-06 15-MAR-07 20-FEB-09 25-MAR-09
M.Andersson M.Andersson M.Andersson M.Andersson
116641
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