DATACOM, PCM TRANSCEIVER, CDIP18, CERAMIC, DIL-18
| Parameter Name | Attribute value |
| Maker | Microsemi |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 18 |
| Reach Compliance Code | unknow |
| JESD-30 code | R-GDIP-T18 |
| JESD-609 code | e0 |
| Number of functions | 1 |
| Number of terminals | 18 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| Telecom integrated circuit types | PCM TRANSCEIVER |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |

| ZN5683J | ZN5683E | |
|---|---|---|
| Description | DATACOM, PCM TRANSCEIVER, CDIP18, CERAMIC, DIL-18 | DATACOM, PCM TRANSCEIVER, PDIP18, PLASTIC, DIL-18 |
| Maker | Microsemi | Microsemi |
| Parts packaging code | DIP | DIP |
| package instruction | DIP, | DIP, |
| Contacts | 18 | 18 |
| Reach Compliance Code | unknow | unknown |
| JESD-30 code | R-GDIP-T18 | R-PDIP-T18 |
| JESD-609 code | e0 | e0 |
| Number of functions | 1 | 1 |
| Number of terminals | 18 | 18 |
| Maximum operating temperature | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V |
| surface mount | NO | NO |
| Telecom integrated circuit types | PCM TRANSCEIVER | PCM TRANSCEIVER |
| Temperature level | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | TIN LEAD | TIN LEAD |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL |