MC2675B8L datasheet, PDF - EEWORLD Datasheet

MC2675B8L: DescriptionSPECIALTY MICROPROCESSOR CIRCUIT, CDIP40, CERAMIC, DIP-40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size355KB，12 Pages; ManufacturerMotorola ( NXP ); Websitehttps://www.nxp.com

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MC2675B8L Overview

SPECIALTY MICROPROCESSOR CIRCUIT, CDIP40, CERAMIC, DIP-40

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Motorola ( NXP )
Parts packaging code	DIP
package instruction	DIP, DIP40,.6
Contacts	40
Reach Compliance Code	unknow
JESD-30 code	R-CDIP-T40
JESD-609 code	e0
length	50.8 mm
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	4.32 mm
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	NO
technology	NMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT

	MC2675B8L	MC2675B5S
Description	SPECIALTY MICROPROCESSOR CIRCUIT, CDIP40, CERAMIC, DIP-40	SPECIALTY MICROPROCESSOR CIRCUIT, CDIP40, CERDIP-40
Is it Rohs certified?	incompatible	incompatible
Maker	Motorola ( NXP )	Motorola ( NXP )
package instruction	DIP, DIP40,.6	DIP, DIP40,.6
Reach Compliance Code	unknow	unknown
JESD-30 code	R-CDIP-T40	R-CDIP-T40
JESD-609 code	e0	e0
length	50.8 mm	52.275 mm
Number of terminals	40	40
Maximum operating temperature	70 °C	70 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP
Encapsulate equivalent code	DIP40,.6	DIP40,.6
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified
Maximum seat height	4.32 mm	5.84 mm
Maximum supply voltage	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V
surface mount	NO	NO
technology	NMOS	NMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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