|
RN2005 |
RN2001 |
RN2002 |
RN2003 |
RN2004 |
RN2006 |
| Description |
Switching, Inverter Circuit, Interface Circuit And Driver Circuit Applications |
Switching, Inverter Circuit, Interface Circuit And Driver Circuit Applications |
Switching, Inverter Circuit, Interface Circuit And Driver Circuit Applications |
Switching, Inverter Circuit, Interface Circuit And Driver Circuit Applications |
Switching, Inverter Circuit, Interface Circuit And Driver Circuit Applications |
Switching, Inverter Circuit, Interface Circuit And Driver Circuit Applications |
| Maker |
Toshiba Semiconductor |
- |
Toshiba Semiconductor |
Toshiba Semiconductor |
Toshiba Semiconductor |
Toshiba Semiconductor |
| Parts packaging code |
TO-92 |
- |
TO-92 |
TO-92 |
TO-92 |
TO-92 |
| package instruction |
CYLINDRICAL, O-PBCY-T3 |
- |
CYLINDRICAL, O-PBCY-T3 |
CYLINDRICAL, O-PBCY-T3 |
CYLINDRICAL, O-PBCY-T3 |
CYLINDRICAL, O-PBCY-T3 |
| Contacts |
3 |
- |
3 |
3 |
3 |
3 |
| Reach Compliance Code |
unknow |
- |
unknow |
unknow |
unknow |
unknow |
| ECCN code |
EAR99 |
- |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Other features |
BUILT-IN BIAS RESISTOR RATIO IS 21.36 |
- |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
BUILT-IN BIAS RESISTOR RATIO IS 10 |
| Maximum collector current (IC) |
0.1 A |
- |
0.1 A |
0.1 A |
0.1 A |
0.1 A |
| Collector-emitter maximum voltage |
50 V |
- |
50 V |
50 V |
50 V |
50 V |
| Configuration |
SINGLE WITH BUILT-IN RESISTOR |
- |
SINGLE WITH BUILT-IN RESISTOR |
SINGLE WITH BUILT-IN RESISTOR |
SINGLE WITH BUILT-IN RESISTOR |
SINGLE WITH BUILT-IN RESISTOR |
| Minimum DC current gain (hFE) |
80 |
- |
50 |
70 |
80 |
80 |
| JEDEC-95 code |
TO-92 |
- |
TO-92 |
TO-92 |
TO-92 |
TO-92 |
| JESD-30 code |
O-PBCY-T3 |
- |
O-PBCY-T3 |
O-PBCY-T3 |
O-PBCY-T3 |
O-PBCY-T3 |
| JESD-609 code |
e0 |
- |
e0 |
e0 |
e0 |
e0 |
| Number of components |
1 |
- |
1 |
1 |
1 |
1 |
| Number of terminals |
3 |
- |
3 |
3 |
3 |
3 |
| Maximum operating temperature |
150 °C |
- |
150 °C |
150 °C |
150 °C |
150 °C |
| Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| Package shape |
ROUND |
- |
ROUND |
ROUND |
ROUND |
ROUND |
| Package form |
CYLINDRICAL |
- |
CYLINDRICAL |
CYLINDRICAL |
CYLINDRICAL |
CYLINDRICAL |
| Polarity/channel type |
PNP |
- |
PNP |
PNP |
PNP |
PNP |
| Maximum power dissipation(Abs) |
0.4 W |
- |
0.4 W |
0.4 W |
0.4 W |
0.4 W |
| Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| surface mount |
NO |
- |
NO |
NO |
NO |
NO |
| Terminal surface |
TIN LEAD |
- |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
| Terminal form |
THROUGH-HOLE |
- |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal location |
BOTTOM |
- |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
| transistor applications |
SWITCHING |
- |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
| Transistor component materials |
SILICON |
- |
SILICON |
SILICON |
SILICON |
SILICON |
| Nominal transition frequency (fT) |
200 MHz |
- |
200 MHz |
200 MHz |
200 MHz |
200 MHz |