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DM54S941J

Description
IC,BUFFER/DRIVER,SINGLE,8-BIT,S-TTL,DIP,20PIN,CERAMIC
Categorylogic    logic   
File Size66KB,2 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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DM54S941J Overview

IC,BUFFER/DRIVER,SINGLE,8-BIT,S-TTL,DIP,20PIN,CERAMIC

DM54S941J Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
Reach Compliance Codecompli
Control typeENABLE HIGH
JESD-30 codeR-XDIP-T20
JESD-609 codee0
Logic integrated circuit typeBUS DRIVER
Number of digits8
Number of functions1
Number of terminals20
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP20,.3
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

DM54S941J Related Products

DM54S941J DM74S940N DM74S941N DM54S940J
Description IC,BUFFER/DRIVER,SINGLE,8-BIT,S-TTL,DIP,20PIN,CERAMIC IC,BUFFER/DRIVER,SINGLE,8-BIT,S-TTL,DIP,20PIN,PLASTIC IC,BUFFER/DRIVER,SINGLE,8-BIT,S-TTL,DIP,20PIN,PLASTIC IC,BUFFER/DRIVER,SINGLE,8-BIT,S-TTL,DIP,20PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible
Reach Compliance Code compli compliant compliant compliant
Control type ENABLE HIGH ENABLE LOW ENABLE HIGH ENABLE LOW
JESD-30 code R-XDIP-T20 R-PDIP-T20 R-PDIP-T20 R-XDIP-T20
JESD-609 code e0 e0 e0 e0
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
Number of digits 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 20 20 20 20
Maximum operating temperature 125 °C 70 °C 70 °C 125 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity TRUE INVERTED TRUE INVERTED
Package body material CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC
encapsulated code DIP DIP DIP DIP
Encapsulate equivalent code DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO NO NO
technology TTL TTL TTL TTL
Temperature level MILITARY COMMERCIAL COMMERCIAL MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL

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