IC,BUFFER/DRIVER,SINGLE,8-BIT,S-TTL,DIP,20PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor(TI ) |
| Reach Compliance Code | compli |
| Control type | ENABLE HIGH |
| JESD-30 code | R-XDIP-T20 |
| JESD-609 code | e0 |
| Logic integrated circuit type | BUS DRIVER |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| DM54S941J | DM74S940N | DM74S941N | DM54S940J | |
|---|---|---|---|---|
| Description | IC,BUFFER/DRIVER,SINGLE,8-BIT,S-TTL,DIP,20PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,8-BIT,S-TTL,DIP,20PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,8-BIT,S-TTL,DIP,20PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,8-BIT,S-TTL,DIP,20PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | compli | compliant | compliant | compliant |
| Control type | ENABLE HIGH | ENABLE LOW | ENABLE HIGH | ENABLE LOW |
| JESD-30 code | R-XDIP-T20 | R-PDIP-T20 | R-PDIP-T20 | R-XDIP-T20 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| Number of digits | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 125 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | TRUE | INVERTED | TRUE | INVERTED |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |